參數(shù)資料
型號(hào): MPC8533VTAQGA
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 37/112頁(yè)
文件大小: 0K
描述: MPU POWERQUICC 783-PBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類(lèi)型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 0.95 V ~ 1.05 V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤(pán)
MPC8533E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 6
30
Freescale Semiconductor
Enhanced Three-Speed Ethernet (eTSEC), MII Management
Figure 13 provides the AC test load for eTSEC.
Figure 13. eTSEC AC Test Load
Figure 14 shows the MII receive AC timing diagram.
Figure 14. MII Receive AC Timing Diagram
8.5
TBI AC Timing Specifications
This section describes the TBI transmit and receive AC timing specifications.
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
ns
RX_CLK clock rise (20%–80%)
tMRXR
1.0
4.0
ns
RX_CLK clock fall time (80%–20%)
tMRXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMRDVKH symbolizes MII receive
timing (MR) with respect to the time data input signals (D) reach the valid state (V) relative to the tMRX clock reference (K)
going to the high (H) state or setup time. Also, tMRDXKL symbolizes MII receive timing (GR) with respect to the time data input
signals (D) went invalid (X) relative to the tMRX clock reference (K) going to the low (L) state or hold time. Note that, in general,
the clock reference symbol representation is based on three letters representing the clock of a particular functional. For
example, the subscript of tMRX represents the MII (M) receive (RX) clock. For rise and fall times, the latter convention is used
with the appropriate letter: R (rise) or F (fall).
Table 28. MII Receive AC Timing Specifications (continued)
At recommended operating conditions with L/TVDD of 3.3 V ± 5%.or 2.5 V ± 5%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Notes
Output
Z0 = 50
LVDD/2
RL = 50
RX_CLK
RXD[3:0]
tMRDXKL
tMRX
tMRXH
tMRXR
tMRXF
RX_DV
RX_ER
tMRDVKH
Valid Data
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