參數(shù)資料
型號: MPC8548EPXAQGB
廠商: Freescale Semiconductor
文件頁數(shù): 146/151頁
文件大小: 0K
描述: IC MPU PWRQUICC III 783FCPBGA
產(chǎn)品培訓(xùn)模塊: MPC8548 PowerQUICC III Processors
標準包裝: 1
系列: MPC85xx
處理器類型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 783-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
94
Freescale Semiconductor
Package Description
Figure 56. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA with Stamped Lid
Notes:
1. All d
imensions are in millimeters.
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Capacitors may not be present on all devices.
6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7. Parallelism measurement shall exclude any effect of mark on top surface of package.
8. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
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