參數(shù)資料
型號： MPC8555VTALD
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 83/88頁
文件大?。?/td> 772K
代理商： MPC8555VTALD
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specification, Rev. 3.1
84
Freescale Semiconductor
Document Revision History
18 Document Revision History
Table 51 provides a revision history for this hardware specification.
19 Device Nomenclature
Ordering information for the parts fully covered by this specification document is provided in
19.1
Nomenclature of Parts Fully Addressed by this Document
Table 52 provides the Freescale part numbering nomenclature for the MPC8555E. Note that the individual
part numbers correspond to a maximum processor core frequency. For available frequencies, contact your
local Freescale sales office. In addition to the processor frequency, the part numbering scheme also
includes an application modifier which may specify special application conditions. Each part number also
contains a revision code which refers to the die mask revision number.
Table 51. Document Revision History
Rev. No.
Date
Substantive Change(s)
3.1
10/2005
Table 4: Added footnote 2 about junction temperature.
Table 4: Added max. power values for 1000 MHz core frequency.
Removed Figure 3, “Maximum AC Waveforms on PCI Interface for 3.3-V Signaling.”
Table 30: Modified note to tLBKSKEW from 8 to 9
Table 30: Changed tLBKHOZ1 and tLBKHOZ2 values.
Table 30: Added note 3 to tLBKHOV1.
Table 30 and Table 31: Modified note 3.
Table 31: Modified values for tLBKHKT, tLBKLOV1, tLBKLOV2, tLBKLOV3, tLBKLOZ1, and tLBKLOZ2.
Figure 20: Changed Input Signals: LAD[0:31]/LDP[0:3].
Table 46: PCI1_CLK and PCI2_CLK changed from I/O to I.
Table 52: Added column for Encryption Acceleration.
3
8/29/2005
Table 43: Modified notes for signals TSEC1_TXD[3:0], TSEC2_TXD[3:0], TRIG_OUT/READY,
2
8/2005
Previous revision’s history listed incorrect cross references. Table 2 is now correctly listed as
Table 27 and Table 38 is now listed as Table 31.
Table 7: Added note 2.
Table 14: Modified min and max values for tDDKHMP
1
6/2005
Table 4: Modified footnote 4 and changed typical power for the 1000MHz core frequency.
Table 31: Corrected symbols for body rows 9–15, effectively changing them from a high state to a
0
6/2005
Initial Release.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8555VTALF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555VTAPF 功能描述:微處理器 - MPU PQ 37 LITE 8555 RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8555VTAQF 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤
MPC855TCVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC855TCVR50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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