參數(shù)資料
型號： MPC8555VTAQDX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 8/88頁
文件大?。?/td> 1244K
代理商： MPC8555VTAQDX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
16
Freescale Semiconductor
RESET Initialization
4.3
Real Time Clock Timing
Table 8 provides the real time clock (RTC) AC timing specifications.
5
RESET Initialization
This section describes the AC electrical specifications for the RESET initialization timing requirements of
the MPC8555E. Table 9 provides the RESET initialization AC timing specifications.
Table 10 provides the PLL and DLL lock times.
Table 8. RTC AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
RTC clock high time
tRTCH
2 x
tCCB_CLK
——
ns
RTC clock low time
tRTCL
2 x
tCCB_CLK
——
ns
Table 9. RESET Initialization Timing Specifications
Parameter/Condition
Min
Max
Unit
Notes
Required assertion time of HRESET
100
—
μs
Minimum assertion time for SRESET
512
—
SYSCLKs
1
PLL input setup time with stable SYSCLK before HRESET
negation
100
—
μs
Input setup time for POR configs (other than PLL config) with
respect to negation of HRESET
4
—
SYSCLKs
1
Input hold time for POR configs (including PLL config) with
respect to negation of HRESET
2
—
SYSCLKs
1
Maximum valid-to-high impedance time for actively driven POR
configs with respect to negation of HRESET
—
5
SYSCLKs
1
Notes:
1. SYSCLK is identical to the PCI_CLK signal and is the primary clock input for the MPC8555E. See the MPC8555E
PowerQUICC III Integrated Communications Processor Reference Manual for more details.
Table 10. PLL and DLL Lock Times
Parameter/Condition
Min
Max
Unit
Notes
PLL lock times
—
100
μs
DLL lock times
7680
122,880
CCB Clocks
1, 2
Notes:
1. DLL lock times are a function of the ratio between the output clock and the platform (or CCB) clock. A 2:1 ratio results in the
minimum and an 8:1 ratio results in the maximum.
2. The CCB clock is determined by the SYSCLK
× platform PLL ratio.
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MPC855TCVR50D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC855TCVR50D4R2 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC855TCVR66D4 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC855TCZP50D4 制造商:Freescale Semiconductor 功能描述:
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