參數(shù)資料
型號(hào): MPC8555VTAQEX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783
封裝: 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783
文件頁(yè)數(shù): 51/88頁(yè)
文件大小: 1244K
代理商: MPC8555VTAQEX
MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
55
Package and Pin Listings
Figure 39 shows the PCI input AC timing conditions.
Figure 39. PCI Input AC Timing Measurement Conditions
Figure 40 shows the PCI output AC timing conditions.
Figure 40. PCI Output AC Timing Measurement Condition
14 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
14.1
Package Parameters for the MPC8555E FC-PBGA
The package parameters are as provided in the following list. The package type is 29 mm
× 29 mm, 783
flip chip plastic ball grid array (FC-PBGA).
Die size
8.7 mm
× 9.3 mm × 0.75 mm
Package outline
29 mm
× 29 mm
Interconnects
783
Pitch
1 mm
Minimum module height 3.07 mm
Maximum module height 3.75 mm
Solder Balls
62 Sn/36 Pb/2 Ag
Ball diameter (typical)
0.5 mm
tPCIVKH
CLK
Input
tPCIXKH
CLK
Output Delay
tPCKHOV
High-Impedance
tPCKHOZ
Output
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
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MPC855TCZP50D4 制造商:Freescale Semiconductor 功能描述: