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參數(shù)資料
| 型號： | MPC8555VTAQEX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 1000 MHz, RISC PROCESSOR, PBGA783 |
| 封裝： | 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, FLIP CHIP, PLASTIC, BGA-783 |
| 文件頁數(shù)： | 68/88頁 |
| 文件大?。?/td> | 1244K |
| 代理商： | MPC8555VTAQEX |
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MPC8555E PowerQUICC III Integrated Communications Processor Hardware Specifications, Rev. 4
70
Freescale Semiconductor
Thermal
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Several
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, Millennium Electronics,
and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8555E to function in various environments.
16.2.1
Recommended Thermal Model
For system thermal modeling, the MPC8555E thermal model is shown in Figure 52. Five cuboids are used
to represent this device. To simplify the model, the solder balls and substrate are modeled as a single block
29x29x1.6 mm with the conductivity adjusted accordingly. The die is modeled as 8.7 x 9.3 mm at a
thickness of 0.75 mm. The bump/underfill layer is modeled as a collapsed resistance between the die and
substrate assuming a conductivity of 4.4 W/mK in the thickness dimension of 0.07 mm. The lid attach
adhesive is also modeled as a collapsed resistance with dimensions of 8.7 x 9.3 x 0.05 mm and the
conductivity of 1.07 W/mK. The nickel plated copper lid is modeled as 11 x 11 x 1 mm.
Figure 43. MPC8555E Thermal Model
Die
Lid
Substrate and solder balls
Heat Source
Substrate
Side View of Model (Not to Scale)
Top View of Model (Not to Scale)
x
y
z
Conductivity
Value
Unit
Lid
(11
× 11 × 1 mm)
kx
360
W/(m
× K)
ky
360
kz
360
Lid Adhesive—Collapsed resistance
(8.7
× 9.3 × 0.05 mm)
kz
1.07
Die
(8.7
× 9.3 × 0.75 mm)
Bump/Underfill—Collapsed resistance
(8.7
× 9.3 × 0.07 mm)
kz
4.4
Substrate and Solder Balls
(25
× 25 × 1.6 mm)
kx
14.2
ky
14.2
kz
1.2
Adhesive
Bump/underfill
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| MPC8555VTAQF | 功能描述:IC MPU POWERQUICC III 783-FCPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - 微處理器 系列:MPC85xx 標(biāo)準(zhǔn)包裝:1 系列:MPC85xx 處理器類型:32-位 MPC85xx PowerQUICC III 特點:- 速度:1.2GHz 電壓:1.1V 安裝類型:表面貼裝 封裝/外殼:783-BBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:783-FCPBGA（29x29） 包裝:托盤 |
| MPC855TCVR50D4 | 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC855TCVR50D4R2 | 功能描述:微處理器 - MPU POWER QUICC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC855TCVR66D4 | 功能描述:微處理器 - MPU POWER QUICC-NO LEAD RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC855TCZP50D4 | 制造商:Freescale Semiconductor 功能描述: |
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