參數(shù)資料
型號： MPC8560PXALDB
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
封裝： 29 X 29 MM, 3.75 MM HEIGHT, 1 MM PITCH, FLIP CHIP, PLASTIC, BGA-783
文件頁數(shù)： 104/108頁
文件大?。?/td> 2170K
代理商： MPC8560PXALDB
MPC8560 Integrated Processor Hardware Specifications, Rev. 3.1
Freescale Semiconductor
95
Thermal
Figure 57. Exploded Views (2) of a Heat Sink Attachment using a Plastic Force
The die junction-to-ambient and the heat sink-to-ambient thermal resistances are common figure-of-merits used for
comparing the thermal performance of various microelectronic packaging technologies, one should exercise caution
when only using this metric in determining thermal management because no single parameter can adequately
describe three-dimensional heat flow. The final die-junction operating temperature is not only a function of the
component-level thermal resistance, but the system level design and its operating conditions. In addition to the
component’s power consumption, a number of factors affect the final operating die-junction temperature: airflow,
board population (local heat flux of adjacent components), system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today’s microelectronic
equipment, the combined effects of the heat transfer mechanisms (radiation convection and conduction) may vary
widely. For these reasons, we recommend using conjugate heat transfer models for the boards, as well as,
system-level designs.
相關(guān)PDF資料
PDF描述
MPC8560CPXALFB 32-BIT, 667 MHz, RISC PROCESSOR, PBGA783
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參數(shù)描述
MPC8560PXAQFB 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560PXAQFC 功能描述:微處理器 - MPU PQ 3 DRACO-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT667LC 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8560VT833LB 功能描述:微處理器 - MPU PQ 3 8560-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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