參數(shù)資料
型號： MPC8568ECVTANGGA
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 800 MHz, RISC PROCESSOR, PBGA1023
封裝： 33 X 33 MM, 2.75 MM HEIGHT, 1 MM PITCH, LEAD FREE, PLASTIC, FCBGA-1023
文件頁數(shù)： 32/139頁
文件大?。?/td> 1449K
代理商： MPC8568ECVTANGGA
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Freescale Semiconductor
127
Thermal
Millennium Electronics offer different heat sink-to-ambient thermal resistances, that will allow the
MPC8568E to function in various environments.
24.2.1
Recommended Thermal Model
For system thermal modeling, the MPC8568E thermal model without a lid is shown in Figure 70. The
substrate is modeled as a block 33x33x1.18 mm with an in-plane conductivity of 24 W/mK and a
through-plane conductivity of 0.92 W/mK. The solder balls and air are modeled as a single block
33x33x0.58 mm with an in-plane conductivity of 0.034 W/mK and a through plane conductivity of 12.2
W/mK. The die is modeled as 8.2x12.1 mm with a thickness of 0.75 mm. The bump/underfill layer is
modeled as a collapsed thermal resistance between the die and substrate assuming a conductivity of 5.3
W/mK in the thickness dimension of 0.07 mm. The die is centered on the substrate. The thermal model
uses approximate dimensions to reduce grid. See the case outline for actual dimensions.
Figure 70. MPC8568E Thermal Model
24.2.2
Internal Package Conduction Resistance
For the packaging technology, shown in Table 87, the intrinsic internal conduction thermal resistance paths
are as follows:
The die junction-to-case thermal resistance
Heat Source
Substrate
Top View of Model (Not to Scale)
x
y
Conductivity
Value
Unit
Die
(8.2
× 12.1 × 0.75mm)
Silicon
Temperature
dependent
W/(m
× K)
Bump/Underfill
(8.2
× 12.1 × 0.75 mm)
Collapsed Resistance
kz
5.3
Substrate
(33
× 33× 1.18 mm)
kx
24
ky
24
kz
0.92
Soldera and Air
(33
× 33 × 0.58 mm)
kx
0.034
ky
0.034
kz
12.2
substrate
solder/air
die
Bump/Underfill
Side View of Model (Not to scale)
Z
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8568ECVTAQGG 功能描述:微處理器 - MPU 8568 1GHz Pb Free RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568E-MDS-PB 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8568E FAMILY ADS RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8568EPXAQGG 功能描述:微處理器 - MPU 8568 PB Encrypt 1GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568EPXAUJJ 功能描述:微處理器 - MPU 8568 PB Encrypt 1.3GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8568EVTAQGG 功能描述:微處理器 - MPU No PB 1.0 GHz RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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