參數(shù)資料
型號(hào)： MPC870ZT133
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 133 MHz, RISC PROCESSOR, PBGA256
封裝： 23 X 23 MM, PLASTIC, BGA-256
文件頁(yè)數(shù)： 7/84頁(yè)
文件大小： 1352K
代理商： MPC870ZT133
15
MPC875/MPC870 Hardware Specifications
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Layout Practices
10
Layout Practices
Each VDD pin on the MPC875/870 should be provided with a low-impedance path to the board’s supply.
Each GND pin should likewise be provided with a low-impedance path to ground. The power supply pins
drive distinct groups of logic on chip. The VDD power supply should be bypassed to ground using at least
four 0.1-F bypass capacitors located as close as possible to the four sides of the package. Each board
designed should be characterized and additional appropriate decoupling capacitors should be used if
required. The capacitor leads and associated printed circuit traces connecting to chip VDD and GND should
be kept to less than half an inch per capacitor lead. At a minimum, a four-layer board employing two inner
layers as VDD and GND planes should be used.
All output pins on the MPC875/870 have fast rise and fall times. Printed circuit (PC) trace interconnection
length should be minimized in order to minimize undershoot and reflections caused by these fast output
switching times. This recommendation particularly applies to the address and data buses. Maximum PC
trace lengths of six inches are recommended. Capacitance calculations should consider all device loads as
well as parasitic capacitances due to the PC traces. Attention to proper PCB layout and bypassing becomes
especially critical in systems with higher capacitive loads because these loads create higher transient
currents in the VDD and GND circuits. Pull up all unused inputs or signals that will be inputs during reset.
Special care should be taken to minimize the noise levels on the PLL supply pins. For more information,
please refer to Section 14.4.3, “Clock Synthesizer Power (VDDSYN, VSSSYN, VSSSYN1),” of the MPC885
PowerQUICC Family User’s Manual.
PAPAR
(Port A pin assignment register)
PAPAR[5:9]
PAPAR[12:13]
0
PADIR
(Port A data direction register)
PADIR[5:9]
PADIR[12:13]
0
PBPAR
(Port B pin assignment register)
PBPAR[14:18]
PBPAR[20:22]
0
PBDIR
(Port B data direction register)
PBDIR[14:8]
PBDIR[20:22]
0
PCPAR
(Port C pin assignment register)
PCPAR[4:5]
PCPAR[8:9]
PCPAR[14]
0
PCDIR
(Port C data direction register)
PCDIR[4:5]
PCDIR[8:9]
PCDIR[14]
0
PDPAR
(Port D pin assignment register)
PDPAR[3:7]
PDPAR[9:5]
0
PDDIR
(Port D data direction register)
PDDIR[3:7]
PDDIR[9:15]
0
Table 7. Mandatory Reset Configuration of MPC875/870 (continued)
Register/Configuration
Field
Value
(binary)
相關(guān)PDF資料
PDF描述
MPC875ZT80 32-BIT, 80 MHz, RISC PROCESSOR, PBGA256
MPC880VR80 32-BIT, 80 MHz, RISC PROCESSOR, PBGA357
MPC885CVR133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
MPC885ZP66 32-BIT, 66 MHz, RISC PROCESSOR, PBGA357
MPC885CZP133 32-BIT, 133 MHz, RISC PROCESSOR, PBGA357
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC870ZT66 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC870ZT80 功能描述:微處理器 - MPU PQ I HIP6W DUET RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC870ZTZZ 制造商:Freescale Semiconductor 功能描述:
MPC875CVR133 功能描述:微處理器 - MPU 133 MHz 176 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC875CVR66 功能描述:微處理器 - MPU 66 MHz 87 MIPS RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*