參數(shù)資料
型號: MPC885
廠商: 飛思卡爾半導(dǎo)體(中國)有限公司
英文描述: Hardware Specifications
中文描述: 硬件規(guī)格
文件頁數(shù): 88/92頁
文件大小: 1499K
代理商: MPC885
MPC885/MPC880 Hardware Specifications, Rev. 3
88
Freescale Semiconductor
Mechanical Data and Ordering Information
16.2 Mechanical Dimensions of the PBGA Package
Figure 77
shows the mechanical dimensions of the PBGA package.
Figure 77. Mechanical Dimensions and Bottom Surface Nomenclature of the PBGA Package
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M—1994.
3. MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM A.
4. DATUM A, THE SEATING PLANE, IS DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
NOTES:
相關(guān)PDF資料
PDF描述
MPC885ZP80 Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:12; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket
MPC885ZP66 Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:41; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:22-41
MPC885CZP66 PT 55C 55#20 PIN RECP
MPC885ZP133 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
MPC885CZP133 Hardware Specifications
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MPC885ADS 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC885ADSE 功能描述:開發(fā)板和工具包 - 其他處理器 DUET885 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
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