參數(shù)資料
型號： MPC885ZP80
廠商： 飛思卡爾半導(dǎo)體(中國)有限公司
元件分類： 圓形連接器
英文描述： Circular Connector; Body Material:Aluminum; Series:PT07; Number of Contacts:12; Connector Shell Size:14; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Socket
中文描述： 硬件規(guī)格
文件頁數(shù)： 12/92頁
文件大?。?/td> 1499K
代理商： MPC885ZP80
MPC885/MPC880 Hardware Specifications, Rev. 3
12
Freescale Semiconductor
Thermal Calculation and Measurement
7
For the following discussions, P
D
= (V
DDL
×
I
DDL
) + PI/O, where PI/O is the power dissipation of the I/O drivers.
NOTE
The V
DDSYN
power dissipation is negligible.
Thermal Calculation and Measurement
7.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, T
J
, in °C can be obtained from the following equation:
T
J
= T
A
+ (R
θ
JA
×
P
D
)
where:
T
A
= ambient temperature oC
R
θ
JA
= package junction-to-ambient thermal resistance (oC/W)
P
D
= power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity T
J
–T
A
) are possible.
7.2 Estimation with Junction-to-Case Thermal Resistance
Historically, thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
R
θ
JA
= R
θ
JC
+ R
θ
CA
where:
R
θ
JA
= junction-to-ambient thermal resistance (oC/W)
R
θ
JC
= junction-to-case thermal resistance (oC/W)
R
θ
CA
= case-to-ambient thermal resistance (oC/W)
R
θ
JC
is device-related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, R
θ
CA
. For instance, the user can change the airflow around the device, add a
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
4
Input capacitance is periodically sampled.
5
A(0:31), TSIZ0/REG, TSIZ1, D(0:31), IRQ(2:4), IRQ6, RD/WR, BURST, IP_B(3:7), PA(0:11), PA13, PA15, PB(14:31),
PC(4:15), PD(3:15), PE(14:31), MII1_CRS, MII_MDIO, MII1_TXEN, MII1_COL.
6
BDIP/GPL_B(5), BR, BG, FRZ/IRQ6, CS(0:7), WE(0:3), BS_A(0:3), GPL_A0/GPL_B0, OE/GPL_A1/GPL_B1,
GPL_A(2:3)/GPL_B(2:3)/CS(2:3), UPWAITA/GPL_A4, UPWAITB/GPL_B4, GPL_A5, ALE_A, CE1_A, CE2_A,
OP(0:3) BADDR(28:30)
相關(guān)PDF資料
PDF描述
MPC885ZP66 Circular Connector; Body Material:Aluminum; Series:PT07; No. of Contacts:41; Connector Shell Size:22; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Circular Contact Gender:Pin; Insert Arrangement:22-41
MPC885CZP66 PT 55C 55#20 PIN RECP
MPC885ZP133 Circular Connector; MIL SPEC:MIL-C-26482, Series I, Solder; Body Material:Aluminum; Series:PT07; No. of Contacts:4; Connector Shell Size:8; Connecting Termination:Solder; Circular Shell Style:Jam Nut Receptacle; Body Style:Straight
MPC885CZP133 Hardware Specifications
MPC92433 1428 MHz Dual Output LVPECL Clock Synthesizer
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