3–132
Motorola Sensor Device Data
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Figure 2. Cross Sectional Diagram SSOP
(not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
WIRE BOND
STAINLESS
STEEL CAP
THERMOPLASTIC
CASE
DIE BOND
SEALED VACUUMREFERENCE
DIE
P1
FLUORO SILICONE
GEL DIE COAT
LEAD
FRAME
ABSOLUTE ELEMENT
VS
Pin 2
5.0 V
GND Pin 3
Vout Pin 4
MPXA6115A
MPXH6115A
to ADC
100 nF
51 K
47 pF
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 1317).
Figure 3 shows a typical application circuit (output source
current operation).
O
5.0
4.5
4.0
3.5
3.0
Pressure (ref: to sealed vacuum in kPa
TYP
MAX
MIN
5
0
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
1
1
2.5
2.0
1.5
1.0
0.5
1
Figure 4. Output versus Absolute Pressure
TRANSFER FUNCTION:
Vout = Vs*(.009*P–.095)
±
Error
VS = 5.0 Vdc
TEMP = 0 to 85
°
C
1
1
Figure 4 shows the sensor output signal relative to pres-
sure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85
°
C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
MPXA6115A/MPXH6115A series pressure sensor operating
characteristics, internal reliability and qualification tests are
based on use of dry air as the pressure media. Media other
than dry air may have adverse effects on sensor perfor-
mance and long–term reliability. Contact the factory for
information regarding media compatibility in your application.
F
Freescale Semiconductor, Inc.
n
.