參數(shù)資料
型號： MSP430F5513IRGC
廠商： TEXAS INSTRUMENTS INC
元件分類： 微控制器/微處理器
英文描述： 16-BIT, FLASH, 25 MHz, RISC MICROCONTROLLER, PQCC64
封裝： GREEN ,PLASTIC, VQFN-64
文件頁數(shù)： 68/115頁
文件大?。?/td> 1159K
代理商： MSP430F5513IRGC
MSP430F551x
MSP430F552x
SLAS590D – OCTOBER 2009 – REVISED APRIL 2010
www.ti.com
Crystal Oscillator, XT1, Low-Frequency Mode
(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
MIN
TYP
MAX
UNIT
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
0.075
XT1DRIVEx = 1, TA = 25°C
Differential XT1 oscillator
crystal current consumption
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
ΔIDVCC.LF
3.0 V
0.170
A
from lowest drive setting, LF
XT1DRIVEx = 2, TA = 25°C
mode
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
0.290
XT1DRIVEx = 3, TA = 25°C
XT1 oscillator crystal
fXT1,LF0
XTS = 0, XT1BYPASS = 0
32768
Hz
frequency, LF mode
XT1 oscillator logic-level
fXT1,LF,SW
square-wave input frequency, XTS = 0, XT1BYPASS = 1(2) (3)
10
32.768
50
kHz
LF mode
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0,
210
fXT1,LF = 32768 Hz, CL,eff = 6 pF
Oscillation allowance for
OALF
k
LF crystals(4)
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1,
300
fXT1,LF = 32768 Hz, CL,eff = 12 pF
XTS = 0, XCAPx = 0(6)
2
XTS = 0, XCAPx = 1
5.5
Integrated effective load
CL,eff
pF
capacitance, LF mode(5)
XTS = 0, XCAPx = 2
8.5
XTS = 0, XCAPx = 3
12.0
XTS = 0, Measured at ACLK,
Duty cycle
LF mode
30
70
%
fXT1,LF = 32768 Hz
Oscillator fault frequency,
fFault,LF
XTS = 0(8)
10
10000
Hz
LF mode(7)
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
1000
XT1DRIVEx = 0, TA = 25°C, CL,eff = 6 pF
tSTART,LF
Startup time, LF mode
3.0 V
ms
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0,
500
XT1DRIVEx = 3, TA = 25°C, CL,eff = 12 pF
(1)
To improve EMI on the XT1 oscillator, the following guidelines should be observed.
(a) Keep the trace between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
(d) Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
(e) Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.
(f) If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.
(2)
When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in
the Schmitt-trigger Inputs section of this datasheet.
(3)
Maximum frequency of operation of the entire device cannot be exceeded.
(4)
Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the
XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following
guidelines, but should be evaluated based on the actual crystal selected for the application:
(a) For XT1DRIVEx = 0, CL,ef f ≤ 6 pF.
(b) For XT1DRIVEx = 1, 6 pF
≤ CL,ef f ≤ 9 pF.
(c) For XT1DRIVEx = 2, 6 pF
≤ CL,ef f ≤ 10 pF.
(d) For XT1DRIVEx = 3, CL,ef f ≥ 6 pF.
(5)
Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Since the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
(6)
Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(7)
Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag.
Frequencies in between might set the flag.
(8)
Measured with logic-level input frequency but also applies to operation with crystals.
56
Copyright 2009–2010, Texas Instruments Incorporated
相關(guān)PDF資料
PDF描述
MSX340PB480 DSP-CROSSBAR SWITCH, PBGA480
MSX532-TB792 DSP-CROSSBAR SWITCH, PBGA792
MSX340-PB480 DSP-CROSSBAR SWITCH, PBGA480
MT5TL8L32T-40IT SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100
MT5TL8L32T-50IT SPECIALTY MICROPROCESSOR CIRCUIT, PQFP100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MSP430F5513IRGCR 功能描述:16位微控制器 - MCU MSP430F552x Mixed Sig Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5513IRGCT 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5513IZQE 功能描述:16位微控制器 - MCU MSP430F552x Mixed Sig Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5513IZQER 功能描述:16位微控制器 - MCU Mixed Signal Micro controller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
MSP430F5514IRGC 功能描述:16位微控制器 - MCU 16B Ultra-Low-Pwr Microcontroller RoHS:否 制造商:Texas Instruments 核心:RISC 處理器系列:MSP430FR572x 數(shù)據(jù)總線寬度:16 bit 最大時鐘頻率:24 MHz 程序存儲器大小:8 KB 數(shù)據(jù) RAM 大小:1 KB 片上 ADC:Yes 工作電源電壓:2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:VQFN-40 安裝風(fēng)格:SMD/SMT
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進入我的后臺，查看報價

*型號 *數(shù)量 廠商 批號 封裝
添加更多采購

我的聯(lián)系方式

*
*
*