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參數(shù)資料
| 型號： | MTDF1N03HDR2 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 小信號晶體管 |
| 英文描述： | 2000 mA, 30 V, 2 CHANNEL, N-CHANNEL, Si, SMALL SIGNAL, MOSFET |
| 封裝： | MICROPAK-8 |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 132K |
| 代理商： | MTDF1N03HDR2 |
MTDF1N03HD
http://onsemi.com
3
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage
(Cpk
≥ 2.0)
(Notes 2. & 4.)
(VGS = 0 Vdc, ID = 250 Adc)
Temperature Coefficient (Positive)
V(BR)DSS
30
–
29
–
Vdc
mV/
°C
Zero Gate Voltage Drain Current
(VDS = 24 Vdc, VGS = 0 Vdc)
(VDS = 24 Vdc, VGS = 0 Vdc, TJ = 125°C)
IDSS
–
1.0
25
Adc
Gate–Body Leakage Current (VGS = ± 20 Vdc, VDS = 0)
IGSS
–
100
nAdc
ON CHARACTERISTICS (Note 2.)
Gate Threshold Voltage
(Cpk
≥ 2.0)
(Note 4.)
(VDS = VGS, ID = 250 Adc)
Threshold Temperature Coefficient (Negative)
VGS(th)
1.0
–
1.6
3.7
–
Vdc
mV/
°C
Static Drain–to–Source On–Resistance
(Cpk
≥ 2.0)
(Note 4.)
(VGS = 10 Vdc, ID = 1.7 Adc)
(VGS = 4.5 Vdc, ID = 0.85 Adc)
RDS(on)
–
96
135
120
160
m
Forward Transconductance (VDS = 10 Vdc, ID = 0.85 Adc)
(Note 2.)
gFS
1.0
2.0
–
Mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(V
25 Vd
V
0 Vd
Ciss
–
140
–
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
f = 1.0 MHz)
Coss
–
70
–
Transfer Capacitance
f = 1.0 MHz)
Crss
–
30
–
SWITCHING CHARACTERISTICS (Note 3.)
Turn–On Delay Time
td(on)
–
7.5
–
ns
Rise Time
(VDS = 15 Vdc, ID = 1.7 Adc,
tr
–
10
–
Turn–Off Delay Time
(VDS 15 Vdc, ID 1.7 Adc,
VGS = 10 Vdc, RG = 6 ) (Note 2.)
td(off)
–
22
–
Fall Time
tf
–
18
–
Turn–On Delay Time
td(on)
–
7.0
–
ns
Rise Time
(VDD = 15 Vdc, ID = 0.85 Adc,
tr
–
8.2
–
Turn–Off Delay Time
(VDD 15 Vdc, ID 0.85 Adc,
VGS = 4.5 Vdc, RG = 6 ) (Note 2.)
td(off)
–
22
–
Fall Time
tf
–
14.5
–
Gate Charge
QT
–
5.0
7.0
nC
(VDS = 24 Vdc, ID = 1.7 Adc,
Q1
–
0.5
–
(VDS 24 Vdc, ID 1.7 Adc,
VGS = 10 Vdc)
Q2
–
1.65
–
Q3
–
1.3
–
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage
(IS = 1.7 Adc, VGS = 0 Vdc) (Note 2.)
(IS = 1.7 Adc, VGS = 0 Vdc,
TJ = 125°C)
VSD
–
0.84
0.7
1.0
–
Vdc
Reverse Recovery Time
(I
17Ad
V
0Vd
trr
–
20
–
ns
(IS = 1.7 Adc, VGS = 0 Vdc,
dIS/dt = 100 A/s) (Note 2.)
ta
–
12
–
dIS/dt = 100 A/s) (Note 2.)
tb
–
8.0
–
Reverse Recovery Storage Charge
QRR
–
0.012
–
C
2. Pulse Test: Pulse Width
≤ 300 s, Duty Cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperature.
4. Reflects typical values.
Cpk =
Max limit – Typ
3 x SIGMA
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