參數(shù)資料
型號(hào)： OQ2541BHP
英文描述： CLOCK/DATA RECOVERY|BIPOLAR|QFP|48PIN|PLASTIC
中文描述： 時(shí)鐘/數(shù)據(jù)恢復(fù)|雙極| QFP封裝| 48PIN |塑料
文件頁(yè)數(shù)： 13/40頁(yè)
文件大?。?/td> 292K
代理商： OQ2541BHP
2000 Sep 18
13
Philips Semiconductors
Product specification
SDH/SONET data and clock recovery unit
STM1/4/16 OC3/12/48 GE
OQ2541BHP; OQ2541BU
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
HANDLING INSTRUCTIONS
Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during
assembly and handling of the bare die. Additional safety can be obtained by bonding the V
EE
and GND pads first, the
remaining pads may then be bonded to their external connections in any order.
THERMAL CHARACTERISTICS
Note
1.
Thermal resistance from junction to ambient is determined with the IC soldered on a standard single sided
57
×
57
×
1.6 mm FR4 epoxy PCB with 35
μ
m thick copper tracks. The measurements are performed in still air.
SYMBOL
PARAMETER
MIN.
MAX.
UNIT
V
EE
V
n
negative supply voltage
DC voltage on pins
CLOOP, CLOOPQ, DLOOP, DLOOPQ, CREF, CREFQ, DIN, DINQ,
DOUT, DOUTQ, COUT and COUTQ
ENL, ALLON, BYPASS, LOCK and LOS
DREF19, DOUT1250, DOUT622, DOUT155, PC and AREF
CAPUPQ and CAPDOQ
input current on pins
ENL, ALLON and BYPASS
CREF, CREFQ, DIN and DINQ
total power dissipation
ambient temperature
junction temperature
storage temperature
6
+0.5
V
1
+0.5
V
V
EE
0.5 +5.5
V
EE
0.5 +0.5
V
EE
+ 0.5
0.5
V
V
V
I
n
20
10
10
65
1
+10
700
+85
+110
+150
mA
mA
mW
°
C
°
C
°
C
P
tot
T
amb
T
j
T
stg
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R
th(j-s)
R
th(j-a)
thermal resistance from junction to solder point
thermal resistance from junction to ambient
46
67
K/W
K/W
in free air; note 1
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