參數(shù)資料
型號： P0080ECRP1
英文描述： MCU CMOS 40 LD 20MHZ 4K EPRM, -40C to +125C, 40-PDIP, TUBE
中文描述： SIDAC的| 25V的五（公報(bào)）最大| 800mA的我（縣）|對92VAR
文件頁數(shù)： 133/161頁
文件大?。?/td> 986K
代理商： P0080ECRP1
SIDACtor
Data Book
Soldering Recommendations
Teccor Electronics
(972) 580-7777
5 - 17
T
excess of 215
°
C, care should be taken such that the maximum temperature of the
leads does not exceed 275
°
C and the maximum temperature of the plastic body does
not exceed 250
°
C (Figure 5-8).
Figure 5-7 Principle of Vapor Phase Soldering
Figure 5-8 Reflow Soldering Profile
During reflow, the surface tension of the liquid solder will draw the leads of the device
towards the center of the soldering area, correcting any misalignment that may have
occurred during placement and allowing the device to set flush on the pad. However, if
the footprints of the pad are not concentrically aligned, the same effect can result in
undesirable shifts as well, hence the importance of using a standard contact pattern
which leaves sufficient room for self-positioning.
After the solder has cooled, connections should be visually inspected and remnants of
the flux removed using a vapor degreaser with an azeotrope solvent or equivalent.
Transport
Cooling pipes
PC board
Heating
elements
Boiling liquid (primary medium)
Vapor phase
zone
Vapor lock
(secondary
medium)
Time (Seconds)
0
0
20
40
60
80
100
120
140
160
180
200
220
240
30
60
90
120
150
180
210
240
270
300
T
C
Pre-Heat
Soak
Reflow
Cool
Down
0.5 - 0.6
C/Sec
1.3 - 1.6
C/Sec
<2.5
C/Sec
<2.5
C/Sec
Peak Temp.
210 - 235
C
Soaking Zone
Reflow Zone
Pre-heating Zone
( 2.0 - 4.0 min. max. )
( 2.0 min. max. )
60 - 90 sec. typical
( 2.0 min. max. )
30 - 60 sec. typical
相關(guān)PDF資料
PDF描述
P0080ECRP2 MCU CMOS 44 LD 20MHZ 4K EPRM, -40C to +125C, 44-MQFP, TRAY
P0300EC MCU CMOS 40 LD 10MHZ 8K OTP, 0C to +70C, 40-PDIP, TUBE
P0300ECRP1 MCU CMOS 40 LD 10MHZ 8K OTP, -40C to +125C, 40-PDIP, TUBE
P0300ECRP2 MCU CMOS 40 LD 10MHZ 8K OTP, -40C to +85C, 40-PDIP, TUBE
P0300SARP MCU CMOS 44 LD 20MHZ 8K OTP, 0C to +70C, 44-PLCC, TUBE
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
P0080ECRP2 功能描述:硅對稱二端開關(guān)元件 500A 6V RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0080Q12ALRP 功能描述:硅對稱二端開關(guān)元件 6V 50A QFN 3X3 2L SIDACtor Bi RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0080Q12ALRP_11 制造商:LITTELFUSE 制造商全稱:Littelfuse 功能描述:Q2L Series 3x3 QFN are low capacitance SIDACtor? devices designed to protect
P0080Q12BLRP 功能描述:硅對稱二端開關(guān)元件 6V 100A QFN 3X3 2L SIDACtor Bi RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
P0080Q22CLRP 功能描述:硅對稱二端開關(guān)元件 6V 500A SIDACtor RoHS:否 制造商:Bourns 轉(zhuǎn)折電流 VBO:40 V 最大轉(zhuǎn)折電流 IBO:800 mA 不重復(fù)通態(tài)電流: 額定重復(fù)關(guān)閉狀態(tài)電壓 VDRM:25 V 關(guān)閉狀態(tài)漏泄電流（在 VDRM IDRM 下）: 保持電流（Ih 最大值）:50 mA 開啟狀態(tài)電壓:5 V 關(guān)閉狀態(tài)電容 CO:120 pF 最大工作溫度:+ 150 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DO-214AA
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