13
Note
In the example of mounting on a printed circuit board in the test circuit in the Data Sheet, more than one
inductor L1 for output matching is connected in parallel. Because the test circuit is an NEC test fixture for
inspection and because there is no optimum L value for the inspection fixture, the necessary L value is
created by connecting plural L1s in parallel. In actual application by the user, the optimum L value can be
obtained by using one chip inductor as described in 5.4.
Remark
Evaluation board
The following two types of evaluation boards are available for these ICs. Because the patterns on
these boards are used for an inspection fixture that easily confirms the characteristics of the ICs, and
because components cannot be mounted in the vicinity of the ICs, the pattern size is greater than the
actual size. This means that these patterns are not recommended patterns.
Table 5-1 shows the major differences of the two types of evaluation boards: TYPE1 and TYPE2.
Because TYPE1 can mount an external inductor to the
S
type circuit of the V
CC
line, it can evaluate
whether this inductor is provided or the dependency of the L value.
TYPE2 can evaluate whether the characteristics can be ensured by using the inductor of about 5 nH of
the power supply
S
type circuit as pattern L when the number of components is reduced. In addition,
because a V
CC
pin monitor line is provided, the leakage from the V
CC
pin can be also evaluated.
The constants of the mounted components for output matching and type differ depending on the
frequency used, and TYPE is not divided by the part number or frequency. When purchasing an
evaluation board, specify the type No. by referring to Table 5-1.
Table 5-1. Types of Evaluation Boards
Type Name (inscribed on pattern)
Features
P
PC8119/20T TYPE1
Can connect external inductor to
S
ype circuit of V
CC
line
P
PC8119/20T TYPE2
Pattern L equivalent to 5 nH is printed for
S
ype circuit of V
CC
line.
Notes on evaluation board (common to TYPE1 and TYPE 2)
(1) 35-
P
m thick copper patterning on both sides of 35
u
42
u
0.4 mm polyimide board
(2) GND pattern on rear side
(3) Solder-plated patterning side
(4)
{
: Through hole
Design the actual print pattern depending on the material of your board and frequency. For foot print and mount
pad dimensions, refer to
Semiconductor Device Mounting Technology Manual (C10535E).
5.4 Parameters for Matching Circuit Designing
The matching circuit constants shown in the Data Sheet are for the evaluation board also shown in the Data
Sheet. This evaluation board is for simple evaluation only and it is considered to be impossible to apply this board in
an actual system. For your reference for designing a matching circuit, Figure 5-3 shows the S parameter values
(MAG and ANG) of the
P
PC8119T and
P
PC8120T (without matching) and an input/output Smith chart. It is
recommended that matching be created based on the parameters at the maximum gain, so that the maximum gain of
these ICs are ensured. For this reason, the parameters shown in Figure 5-3 are at the maximum gain (changes in
the impedance at the minimum gain poses no problem to the actual application). Optimize the matching circuit
constants by considering these parameters and the mounting board element.