參數(shù)資料
型號: P2600ECRP2
英文描述: MCU CMOS 44 LD 40MHZ 8K OTP, -40C to +85C, 44-PLCC, T/R
中文描述: SIDAC的| 300V五(公報)最大| 800mA的我(縣)|對92VAR
文件頁數(shù): 134/161頁
文件大?。?/td> 986K
代理商: P2600ECRP2
Soldering Recommendations
SIDACtor
Data Book
5 - 18
Teccor Electronics
(972) 580-7777
Wave Soldering
Another common method for soldering components to a PCB is wave soldering. After
fluxing the PCB, an adhesive is applied to the respective footprints such that
components can be glued in place. Once the adhesive has cured, the board is pre-
heated and then placed in contact with a molten wave of solder which has a
temperature between 240
°
C - 260
°
C and permanently affixes the component to the
PCB.
Although a popular method of soldering, wave soldering does have some drawbacks:
1. A double pass is often required to remove excess solder.
2. Solder bridging and shadows begin to occur as board density increases.
3. Wave soldering utilizes the sharpest thermal gradient.
Figure 5-9 Wave Soldering Surface Mount Components Only
Figure 5-10 Wave Soldering Surface Mount and Leaded Components
Apply glue
Screen print glue
Place component
Cure glue
Wave solder
PC board
Insert
leaded
components
Turn over
PC board
Apply
glue
Place
SMDs
Cure
glue
Turn over
PC board
Wave solder
相關(guān)PDF資料
PDF描述
P2600SARP MCU CMOS 44 LD LOW PWR, -40C to +85C, 44-TQFP, TRAY
P2600SBRP MCU CMOS 40 LD 40MHZ 16K OTP, -40C to +125C, 40-PDIP, TUBE
P2600SCRP SIDAC|300V V(BO) MAX|800MA I(S)|DO-214AA
P3000AA61RP MCU CMOS 44LD LOW PWR, -40C to +85C, 44-QFN, T/R
P3002AA SIDAC|180V V(BO) MAX|800MA I(S)|TO-220VAR
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