參數(shù)資料
型號: PC7447VG933N
廠商: Atmel Corp.
英文描述: PowerPC 7457 RISC Microprocessor
中文描述: 7457的PowerPC RISC微處理器
文件頁數(shù): 38/66頁
文件大小: 522K
代理商: PC7447VG933N
38
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Package Mechanical
Data
The following sections provide the package parameters and mechanical dimensions for
the CBGA package.
Package Parameters for
the PC7447, 360 CBGA
The package parameters are as provided in the following list. The package type is
25 × 25 mm, 360-lead ceramic ball grid array (CBGA).
Package outline
25 mm × 25 mm
Interconnects
360 (19 × 19 ball array - 1)
Pitch
1.27 mm (50 mil)
Minimum module height
2.72 mm
Maximum module height
3.24 mm
Ball diameter
0.89 mm (35 mil)
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相關代理商/技術參數(shù)
參數(shù)描述
PC7447VGH1000L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7447VGH1000N 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7447VGH1200L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7447VGH1200N 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor
PC7447VGH933L 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor