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參數(shù)資料
| 型號(hào)： | PC7447VGH1200N |
| 廠商： | Atmel Corp. |
| 英文描述： | PowerPC 7457 RISC Microprocessor |
| 中文描述： | 7457的PowerPC RISC微處理器 |
| 文件頁(yè)數(shù)： | 15/66頁(yè) |
| 文件大小： | 522K |
| 代理商： | PC7447VGH1200N |
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15
PC7457/47 [Preliminary]
5345B–HIREL–02/04
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(CBGA) package for air-cooled applications. Proper thermal control design is primarily
dependent on the system-level design – the heat sink, airflow, and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods – spring clip to holes in the printed-circuit board or pack-
age, and mounting clip and screw assembly (see Figure 32 on page 55); however, due
to the potential large mass of the heat sink, attachment through the printed-circuit board
is suggested. If a spring clip is used, the spring force should not exceed 10 pounds.
Figure 5.
Package Exploded Cross-sectional View with Several Heat Sink Options
Printed-Circuit Board
Thermal Interface
Material
Heat Sink
Clip
Heat Sink
CBGA Package
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| PC7447VGH933L | PowerPC 7457 RISC Microprocessor |
| PC7447VGH933N | PowerPC 7457 RISC Microprocessor |
| PC7457 | PowerPC 7457 RISC Microprocessor |
| PC7457MGU1000L | PowerPC 7457 RISC Microprocessor |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PC7447VGH933L | 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor |
| PC7447VGH933N | 制造商:ATMEL 制造商全稱(chēng):ATMEL Corporation 功能描述:PowerPC 7457 RISC Microprocessor |
| PC7448FGH1267ND | 制造商:e2v technologies 功能描述:PC7448FGH1267ND - Trays |
| PC7448MGH1000ND | 制造商:e2v technologies 功能描述:PC7448MGH1000ND - Trays |
| PC7448MGH1250ND | 制造商:e2v technologies 功能描述:MPU RISC 32BIT 0.09UM 1.25GHZ 1.5V/1.8V/2.5V 360HITCE CBGA - Trays |
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