參數(shù)資料
型號: PC755CVGSU350LE
廠商: ATMEL CORP
元件分類: 微控制器/微處理器
英文描述: PowerPC 755/745 RISC Microprocessor
中文描述: 32-BIT, 350 MHz, RISC PROCESSOR, CBGA360
封裝: SOLDER COLUMN INTERPOSER, CERAMIC, BGA-360
文件頁數(shù): 19/50頁
文件大?。?/td> 1064K
代理商: PC755CVGSU350LE
19
PC755/745
2138D–HIREL–06/03
Thermal Management
Information
This section provides thermal management information for the ceramic ball grid array
(BGA) package for air-cooled applications. Proper thermal control design is primarily
dependent upon the system-level design-the heat sink, airflow and thermal interface
material. To reduce the die-junction temperature, heat sinks may be attached to the
package by several methods-adhesive, spring clip to holes in the printed-circuit board or
package, and mounting clip and screw assembly; see Figure 7. This spring force should
not exceed 5.5 pounds of force.
Figure 7.
Package Exploded Cross-Sectional View with Several Heat Sink Options
Ultimately, the final selection of an appropriate heat sink depends on many factors, such
as thermal performance at a given air velocity, spatial volume, mass, attachment
method, assembly, and cost.
Adhesive
or
Thermal Interface Material
Heat Sink
Heat Sink
Clip
Printed ± Circuit Board
Option
BGA Package
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