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參數(shù)資料
| 型號(hào)： | PCA9500PW,112 |
| 廠商： | NXP Semiconductors |
| 文件頁(yè)數(shù)： | 14/26頁(yè) |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 96 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 8 |
| 中斷輸出： | 無(wú) |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 2.5 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類(lèi)型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 16-TSSOP |
| 包裝： | 管件 |
| 包括： | EEPROM，POR |
| 產(chǎn)品目錄頁(yè)面： | 824 (CN2011-ZH PDF) |
| 其它名稱(chēng)： | 568-1025-5 935271534112 PCA9500PW |
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PCA9500_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 15 April 2009
21 of 26
NXP Semiconductors
PCA9500
8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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