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參數(shù)資料
| 型號： | PCA9500PW,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 15/26頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I/O EXPANDER I2C 8B 16TSSOP |
| 產品培訓模塊： | I²C Bus Fundamentals |
| 特色產品： | NXP - I2C Interface |
| 標準包裝： | 96 |
| 接口： | I²C，SM 總線 |
| 輸入/輸出數(shù)： | 8 |
| 中斷輸出： | 無 |
| 頻率 - 時鐘： | 400kHz |
| 電源電壓： | 2.5 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 16-TSSOP（0.173"，4.40mm 寬） |
| 供應商設備封裝： | 16-TSSOP |
| 包裝： | 管件 |
| 包括： | EEPROM，POR |
| 產品目錄頁面： | 824 (CN2011-ZH PDF) |
| 其它名稱： | 568-1025-5 935271534112 PCA9500PW |
PCA9500_4
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 04 — 15 April 2009
22 of 26
NXP Semiconductors
PCA9500
8-bit I2C-bus and SMBus I/O port with 2-kbit EEPROM
14.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 27) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 8 and 9
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 27.
Table 8.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 9.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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