- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄3775 > PCA9505DGG,112 (NXP Semiconductors)IC I/O EXPANDER I2C 40B 56TSSOP PDF資料下載
參數(shù)資料
| 型號(hào)： | PCA9505DGG,112 |
| 廠商： | NXP Semiconductors |
| 文件頁數(shù)： | 22/34頁 |
| 文件大小： | 0K |
| 描述： | IC I/O EXPANDER I2C 40B 56TSSOP |
| 產(chǎn)品培訓(xùn)模塊： | I²C Bus Fundamentals |
| 特色產(chǎn)品： | NXP - I2C Interface |
| 標(biāo)準(zhǔn)包裝： | 35 |
| 接口： | I²C |
| 輸入/輸出數(shù)： | 40 |
| 中斷輸出： | 是 |
| 頻率 - 時(shí)鐘： | 400kHz |
| 電源電壓： | 2.3 V ~ 5.5 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 56-TFSOP（0.240"，6.10mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 56-TSSOP |
| 包裝： | 管件 |
| 包括： | POR |
| 產(chǎn)品目錄頁面： | 824 (CN2011-ZH PDF) |
| 其它名稱： | 568-4244-5 935284486112 PCA9505DGG |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁第16頁第17頁第18頁第19頁第20頁第21頁當(dāng)前第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁第32頁第33頁第34頁
PCA9505_9506
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 4 — 3 August 2010
29 of 34
NXP Semiconductors
PCA9505/06
40-bit I2C-bus I/O port with RESET, OE and INT
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
16.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 22) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 12 and 13
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 22.
Table 12.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 13.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ATTINY13-20MUR | IC MCU AVR 1K FLASH 10MHZ 20MLF |
| 5-530520-1 | CONT.HIGH CURRENT L.P. |
| 5-583875-6 | TWIN LEAF CONTACT |
| ATTINY861A-SUR | MCU AVR 8KB FLASH 20MHZ 20SOIC |
| 5-66067-5 | CONT AMP LEAF L/P 15 AU/100 SN |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCA9506 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:40-bit I2C-bus I/O port with RESET, OE and INT |
| PCA9506BS | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:40-bit I2C-bus I/O port with RESET, OE and INT |
| PCA9506BS,118 | 功能描述:接口-I/O擴(kuò)展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
| PCA9506BS,118-CUT TAPE | 制造商:NXP 功能描述:PCA9506 Series 40-Bit I2C-Bus I/O Port with RESET OE and INT - HVQFN - 56 |
| PCA9506DGG | 功能描述:接口-I/O擴(kuò)展器 I/O EXPANDER I2C RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。