參數(shù)資料
型號： PCA9539PW,112
廠商： NXP Semiconductors
文件頁數(shù)： 21/37頁
文件大?。?/td> 0K
描述： IC I/O EXPANDER I2C 16B 24TSSOP
產(chǎn)品培訓模塊： I²C Bus Fundamentals
特色產(chǎn)品： NXP - I2C Interface
標準包裝： 63
接口： I²C，SM 總線
輸入/輸出數(shù)： 16
中斷輸出： 是
頻率 - 時鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-TSSOP（0.173"，4.40mm 寬）
供應商設(shè)備封裝： 24-TSSOP
包裝： 管件
包括： POR
產(chǎn)品目錄頁面： 825 (CN2011-ZH PDF)
其它名稱： 568-5025
935277298112
PCA9539PW
PCA9539PW,112-ND
PCA9539PW-ND
PCA9539_PCA9539R
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 6 — 6 February 2013
28 of 37
NXP Semiconductors
PCA9539; PCA9539R
16-bit I2C-bus and SMBus low power I/O port with interrupt and reset
Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specifications, including temperature and impurities
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 18 and 19
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 30.
Table 18.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350
< 2.5
235
220
2.5
220
Table 19.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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PCA9539PW118 制造商:NXP Semiconductors 功能描述:IC I/O EXPANDER 16BIT 400KHZ TSSOP24
PCA9539PWE4 功能描述:接口-I/O擴展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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PCA9539PWR 功能描述:接口-I/O擴展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9539PWRE4 功能描述:接口-I/O擴展器 16-Bit I2C & SMBus Lo-Pwr I/O Expander RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
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