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參數(shù)資料
型號： PCA9555BS,118
廠商： NXP Semiconductors
文件頁數(shù)： 24/34頁
文件大小： 0K
描述： IC I/O EXPANDER I2C 16B 24HVQFN
產(chǎn)品培訓(xùn)模塊： I²C Bus Fundamentals
特色產(chǎn)品： NXP - I2C Interface
標(biāo)準(zhǔn)包裝： 1
接口： I²C，SM 總線
輸入/輸出數(shù)： 16
中斷輸出： 是
頻率 - 時(shí)鐘： 400kHz
電源電壓： 2.3 V ~ 5.5 V
工作溫度： -40°C ~ 85°C
安裝類型： 表面貼裝
封裝/外殼： 24-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 24-HVQFN（4x4）
包裝： 標(biāo)準(zhǔn)包裝
包括： POR
產(chǎn)品目錄頁面： 826 (CN2011-ZH PDF)
配用： 568-4002-ND - DEMO BOARD I2C
其它名稱： 568-2382-6
PCA9555_8
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 08 — 22 October 2009
30 of 34
NXP Semiconductors
PCA9555
16-bit I2C-bus and SMBus I/O port with interrupt
For further information on temperature proles, refer to Application Note
AN10365
“Surface mount reow soldering description”.
16. Soldering of through-hole mount packages
16.1 Introduction to soldering through-hole mount packages
This text gives a very brief insight into wave, dip and manual soldering.
Wave soldering is the preferred method for mounting of through-hole mount IC packages
on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder
pastes is increasing. Typical dwell time of the leads in the wave ranges from
3 seconds to 4 seconds at 250
°C or 265 °C, depending on solder material applied, SnPb
or Pb-free respectively.
The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic
body must not exceed the specied maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling may be necessary immediately
after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the
seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is
less than 300
°C it may remain in contact for up to 10 seconds. If the bit temperature is
between 300
°C and 400 °C, contact may be up to 5 seconds.
MSL: Moisture Sensitivity Level
Fig 32. Temperature proles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
PCA9555D 功能描述:接口-I/O擴(kuò)展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555D,112 功能描述:接口-I/O擴(kuò)展器 I2C/SMBUS 16BIT GPIO RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555D,118 功能描述:接口-I/O擴(kuò)展器 16-BIT I2C FM TP GPIO INT PU RoHS:否 制造商:NXP Semiconductors 邏輯系列: 輸入/輸出端數(shù)量: 最大工作頻率:100 kHz 工作電源電壓:1.65 V to 5.5 V 工作溫度范圍:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:HVQFN-16 封裝:Reel
PCA9555D,118-CUT TAPE 制造商:NXP 功能描述:PCA9555 Series 16-bit I2C-bus and SMBus I/O port w/ Interrupt - SOIC - 24
PCA9555D/G-T 功能描述:IC I/O EXPANDER I2C 16B 24SOIC RoHS:是 類別:集成電路 (IC) >> 接口 - I/O 擴(kuò)展器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:74 系列:- 接口:I²C，JTAG 輸入/輸出數(shù):9 中斷輸出:無 頻率 - 時(shí)鐘:400kHz 電源電壓:2.7 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:20-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商設(shè)備封裝:20-TSSOP 包裝:管件 包括:EEPROM
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