參數(shù)資料
型號: PIC10F222-E/OT
廠商: Microchip Technology
文件頁數(shù): 77/86頁
文件大?。?/td> 0K
描述: IC PIC MCU FLASH 512X12 SOT-23-6
標(biāo)準(zhǔn)包裝: 3,000
系列: PIC® 10F
核心處理器: PIC
芯體尺寸: 8-位
速度: 8MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 4
程序存儲器容量: 768B(512 x 12)
程序存儲器類型: 閃存
RAM 容量: 23 x 8
電壓 - 電源 (Vcc/Vdd): 2 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 2x8b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 125°C
封裝/外殼: SOT-23-6
包裝: 散裝
2007 Microchip Technology Inc.
DS41270E-page 77
PIC10F220/222
8-Lead Plastic Dual Flat, No Lead Package (MC) – 2x3x0.9 mm Body [DFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Package is saw singulated.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
MILLIMETERS
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
0.50 BSC
Overall Height
A
0.80
0.90
1.00
Standoff
A1
0.00
0.02
0.05
Contact Thickness
A3
0.20 REF
Overall Length
D
2.00 BSC
Overall Width
E
3.00 BSC
Exposed Pad Length
D2
1.30
1.75
Exposed Pad Width
E2
1.50
1.90
Contact Width
b
0.18
0.25
0.30
Contact Length
L
0.30
0.40
0.50
Contact-to-Exposed Pad
K
0.20
D
N
E
NOTE 1
1
2
EXPOSED PAD
NOTE 1
2
1
D2
K
L
E2
N
e
b
A3
A1
A
NOTE 2
BOTTOM VIEW
TOP VIEW
Microchip Technology Drawing C04-123B
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