參數(shù)資料
型號(hào): PIC12CE518-04I/SN
廠商: Microchip Technology
文件頁(yè)數(shù): 3/113頁(yè)
文件大?。?/td> 0K
描述: IC MCU OTP 512X12 W/EE 8SOIC
產(chǎn)品培訓(xùn)模塊: Asynchronous Stimulus
標(biāo)準(zhǔn)包裝: 100
系列: PIC® 12C
核心處理器: PIC
芯體尺寸: 8-位
速度: 4MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 5
程序存儲(chǔ)器容量: 768B(512 x 12)
程序存儲(chǔ)器類(lèi)型: OTP
EEPROM 大?。?/td> 16 x 8
RAM 容量: 25 x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 5.5 V
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 85°C
封裝/外殼: 8-SOIC(0.154",3.90mm 寬)
包裝: 管件
配用: 309-1046-ND - ADAPTER 8-SOIC TO 8-DIP
309-1045-ND - ADAPTER 8-SOIC TO 8-DIP
PIC12C5XX
DS40139E-page 100
1999 Microchip Technology Inc.
Package Type:
K04-018 8-Lead Plastic Dual In-line (P) – 300 mil
* Controlling Parameter.
Dimension “B1” does not include dam-bar protrusions. Dam-bar protrusions shall not exceed 0.003”
(0.076 mm) per side or 0.006” (0.152 mm) more than dimension “B1.”
Dimensions “D” and “E” do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed 0.010” (0.254 mm) per side or 0.020” (0.508 mm) more than dimensions “D” or “E.”
0.310
0.267
0.245
0.355
0.120
0.005
0.060
0.140
0.006
0.000
0.055
0.014
Mold Draft Angle Bottom
Mold Draft Angle Top
Overall Row Spacing
Radius to Radius Width
Molded Package Width
Tip to Seating Plane
Base to Seating Plane
Top of Lead to Seating Plane
Top to Seating Plane
Upper Lead Width
Lower Lead Width
PCB Row Spacing
Package Length
Lead Thickness
Shoulder Radius
Number of Pins
Pitch
eB
β
α
L
E1
E
D
A2
A1
A
B
B1
R
c
n
p
Dimension Limits
Units
MIN
0.380
0.342
5
10
15
0.130
0.280
0.250
0.370
0.020
0.080
0.150
0.018
0.012
0.005
0.060
0.100
0.300
8
0.292
0.260
0.385
0.140
0.035
0.100
0.160
0.015
0.010
0.065
0.022
9.65
8.67
7.87
5
10
15
7.10
6.35
9.40
3.30
0.51
2.03
3.81
0.29
0.13
1.52
0.46
2.54
7.62
3.05
6.78
6.22
9.02
0.13
1.52
3.56
0.36
0.20
0.00
1.40
3.56
7.42
6.60
9.78
0.89
2.54
4.06
8
0.56
0.38
0.25
1.65
MIN
NOM
INCHES*
MAX
MILLIMETERS
NOM
MAX
n
1
2
R
D
E
c
β
eB
E1
α
p
A1
L
A
A2
B
B1
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