參數(shù)資料
型號: PIC12CE674/JW
廠商: Microchip Technology
文件頁數(shù): 21/129頁
文件大小: 0K
描述: IC MCU EPROM 2KX14 A/D&EE 8CDIP
標(biāo)準(zhǔn)包裝: 56
系列: PIC® 12C
核心處理器: PIC
芯體尺寸: 8-位
速度: 10MHz
外圍設(shè)備: POR,WDT
輸入/輸出數(shù): 5
程序存儲器容量: 3.5KB(2K x 14)
程序存儲器類型: EPROM,UV
EEPROM 大小: 16 x 8
RAM 容量: 128 x 8
電壓 - 電源 (Vcc/Vdd): 3 V ~ 5.5 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 4x8b
振蕩器型: 內(nèi)部
工作溫度: 0°C ~ 70°C
封裝/外殼: 8-CDIP(0.300",7.62mm)窗口
包裝: 管件
配用: ISPICR1-ND - ADAPTER IN-CIRCUIT PROGRAMMING
AC124001-ND - MODULE SKT PROMATEII 8DIP/SOIC
1999 Microchip Technology Inc.
DS30561B-page 117
PIC12C67X
8-Lead Plastic Small Outline (SM) – Medium, 208 mil (SOIC)
Foot Angle
φ
04
80
48
15
12
0
15
12
0
β
Mold Draft Angle Bottom
15
12
0
15
12
0
α
Mold Draft Angle Top
0.51
0.43
0.36
.020
.017
.014
B
Lead Width
0.25
0.23
0.20
.010
.009
.008
c
Lead Thickness
0.76
0.64
0.51
.030
.025
.020
L
Foot Length
5.33
5.21
5.13
.210
.205
.202
D
Overall Length
5.38
5.28
5.11
.212
.208
.201
E1
Molded Package Width
8.26
7.95
7.62
.325
.313
.300
E
Overall Width
0.25
0.13
0.05
.010
.005
.002
A1
Standoff
1.98
.078
A2
Molded Package Thickness
2.03
.080
A
Overall Height
1.27
.050
p
Pitch
8
n
Number of Pins
MAX
NOM
MIN
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
INCHES*
Units
α
A2
A
A1
L
c
β
φ
2
1
D
n
p
B
E
E1
.070
.075
.069
.074
1.78
1.75
1.97
1.88
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
Drawing No. C04-056
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