Table 21. Flash command timing specifications (continued)
Symbol
Description
Min.
Typ.
Max.
Unit
Notes
tswapx01
tswapx02
tswapx04
tswapx08
Swap Control execution time
control code 0x01
control code 0x02
control code 0x04
control code 0x08
—
200
70
—
150
30
μs
tpgmpart64k
tpgmpart256k
Program Partition for EEPROM execution time
256 KB FlexNVM
—
450
—
ms
tsetramff
tsetram32k
tsetram64k
tsetram256k
Set FlexRAM Function execution time:
Control Code 0xFF
32 KB EEPROM backup
64 KB EEPROM backup
256 KB EEPROM backup
—
70
0.8
1.3
4.5
—
1.2
1.9
5.5
μs
ms
Byte-write to FlexRAM for EEPROM operation
teewr8bers Byte-write to erased FlexRAM location execution
time
—
175
260
μs
teewr8b32k
teewr8b64k
teewr8b128k
teewr8b256k
Byte-write to FlexRAM execution time:
32 KB EEPROM backup
64 KB EEPROM backup
128 KB EEPROM backup
256 KB EEPROM backup
—
385
475
650
1000
1800
2000
2400
3200
μs
Word-write to FlexRAM for EEPROM operation
teewr16bers Word-write to erased FlexRAM location
execution time
—
175
260
μs
teewr16b32k
teewr16b64k
teewr16b128k
teewr16b256k
Word-write to FlexRAM execution time:
32 KB EEPROM backup
64 KB EEPROM backup
128 KB EEPROM backup
256 KB EEPROM backup
—
385
475
650
1000
1800
2000
2400
3200
μs
Longword-write to FlexRAM for EEPROM operation
teewr32bers Longword-write to erased FlexRAM location
execution time
—
360
540
μs
teewr32b32k
teewr32b64k
teewr32b128k
teewr32b256k
Longword-write to FlexRAM execution time:
32 KB EEPROM backup
64 KB EEPROM backup
128 KB EEPROM backup
256 KB EEPROM backup
—
630
810
1200
1900
2050
2250
2675
3500
μs
Peripheral operating requirements and behaviors
K60 Sub-Family Data Sheet Data Sheet, Rev. 7, 02/2013.
34
Freescale Semiconductor, Inc.