參數(shù)資料
型號(hào): RT9641AC32
廠(chǎng)商: Electronic Theatre Controls, Inc.
英文描述: TRIPLE LINEAR REGULATOR CONTROLLER SUPPORT
中文描述: 三重線(xiàn)性穩(wěn)壓器控制器支持
文件頁(yè)數(shù): 9/14頁(yè)
文件大?。?/td> 232K
代理商: RT9641AC32
RT9641A/B
DS9641A/B-03 March 2002
www.richtek-ic.com.tw
9
The power components (pass transistors) and the
controller IC should be placed first. The controller
should be placed in a central position on the
motherboard, closer to the memory load if possible.
Ensure the VSEN2 connection is properly sized to
carry 300mA without significant resistive losses. The
pass transistors should be placed on pads capable of
heatsinking, matching the device’s power dissipation.
Where applicable, multiple via corrections to a large
internal plane can significantly lower localized device
temperature rise.
Fig.1 Printed Circuit Board Islands
Placement of the decoupling and bulk capacitors
should follow a placement reflecting their purpose. As
such, the high-frequency decoupling capacitors (C
HF
)
should be placed as close as possible to the load they
are decoupling; the ones decoupling the controller
(C
12V
, C
5VSB
) close to the controller pins, the one
decoupling the load close to the load connector or the
load itself (if embedded). The bulk capacitance
(aluminum
electrolytic
or
placement is not as critical as the high-frequency
tantalum
capacitors)
capacitor placement, but having these capacitors close
to the load they serve is preferable.
The only critical small signal component is the soft-
start capacitor, C
SS
. Locate the component close to SS
pin of the control IC and connect to ground though a
vias placed close to the capacitor’s ground pad.
Minimize any leakage current paths from SS node,
since the internal current source is only 5
μ
A.
A multi-layer printed circuit board is recommended.
Fig.1 shows the connections of most of the
components to the converter. Note that each individual
capacitor
could
represent
capacitors. Dedicate one solid layer for a ground plane
and make all critical component ground connections
through vias placed as close to the component as
possible. Dedicate another solid layer as a power
plane and break this plane into smaller islands of
common voltage levels. Ideally, the power plane should
support both the input power and output power nodes.
Use copper filled polygons on the top and bottom
circuit layers to create power islands connecting the
filtering components (output capacitors) and the loads.
Use the remaining printed circuit layers for small signal
wiring.
numerous
physical
Component Selection Guidelines
Output Capacitors Selection
The output capacitors for all outputs should be
selected to allow the output voltage to meet the
dynamic regulation requirements of active state
operation (S0, S1). The load transient for the various
microprocessor system’s components may require high
quality capacitors to supply the high slew rate (di/dt)
current demands. Thus, it is recommended that
capacitors C
OUT1
and C
OUT2
should be selected for
transient load regulation.
Also, during the transition between active and sleep
states, there is a short interval of time during which
none of the power pass elements are conducting-
during this time the output capacitors have to supply all
the output current. The output voltage drop during this
brief period of time can be approximated with the
following formula:
V
OUT
= I
OUT
x (ESR
OUT
+ t
t
/ C
OUT
), where
ISLAND ON POWER PLANE LAYER
ISLAND ON CIRCUIT/POWER PLANE LAYER
VIA CONNECTION TO GROUND PLANE
L
L
+12V
IN
+5V
SB
C
12V
C
5VSB
C
IN
Q2
V
OUT1
V
OUT2
+5V
IN
C
HF2
+3.3V
IN
Q1
C
BULK2
C
BULK3
C
BULK1
C
SS
C
HF1
Q3
Q4
12V
SS
5VSB
5VDLSB
5VDL
DLA
VSEN2
DRV2
GND
3V3DL
RT9641A/B
3V3DLSB
V
OUT3
C
HF3
Q5
L
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