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參數(shù)資料
| 型號(hào)： | RTL8100L |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | REALTEK SINGLE CHIP FAST ETHERNET CONTROLLER WITH POWER MANAGEMENT |
| 中文描述： | 瑞昱單芯片快速以太網(wǎng)控制器電源管理 |
| 文件頁(yè)數(shù)： | 57/58頁(yè) |
| 文件大?。?/td> | 657K |
| 代理商： | RTL8100L |
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RTL8100B(L)
2001-11-9
Rev.1.41
57
12.2 LQFP
Notes:
1.To be determined at seating plane -c-
2.Dimensions D
1
and E
1
do not include mold protrusion.
D
1
and E
1
are maximum plastic body size dimensions
Max including mold mismatch.
1.70 3.Dimension b does not include dambar protrusion.
0.20 Dambar can not be located on the lower radius of the foot.
1.50 4.Exact shape of each corner is optional.
0.29 5.These dimensions apply to the flat section of the lead
0.25 between 0.10 mm and 0.25 mm from the lead tip.
0.20 6. A
1
is defined as the distance from the seating plane
0.16 to the lowest point of the package body.
16.00 BSC
7.Controlling dimension : millimeter.
14.00 BSC
8. Reference document : JEDEC MS-026 , BED.
16.00 BSC
TITLE : 100LD LQFP ( 14x14x1.4mm)
14.00 BSC
PACKAGE OUTLINE DRAWING , FOOTPRINT 2.0mm
0.50 BSC
LEADFRAME MATERIAL:
0.016 0.024 0.031 0.40
0.60
0.80 APPROVE
0.039 REF
1.00 REF
0°
3.5°
9°
0°
3.5°
9°
0°
-
-
0°
-
-
CHECK
12°TYP
12°TYP
12°TYP
12°TYP
Symbol Dimension in inch
Min
A
-
A
1
0.000 0.004 0.008 0.00
A
2
0.051 0.055 0.059 1.30
b
0.006 0.009 0.011
b
1
0.006 0.008 0.010 0.15
c
0.004
c
1
0.004
D
0.630 BSC
D
1
0.551 BSC
E
0.630 BSC
E
1
0.551 BSC
e
0.020 BSC
L
L
1
θ
θ
1
θ
2
θ
3
Dimension in mm
Min
Nom
-
-
0.1
1.40
0.
15
0.22
0.20
0.008 0.09
0.006 0.09
Nom
-
Max
0.067
-
-
-
-
DOC. NO.
VERSION 1
PAGE
DWG NO. LQ100 - P1
DATE
OF
REALTEK SEMICONDUCTOR CORP.
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