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參數(shù)資料
| 型號(hào)： | S71GL064A04BFI0B2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁(yè)數(shù)： | 74/102頁(yè) |
| 文件大?。?/td> | 1606K |
| 代理商： | S71GL064A04BFI0B2 |
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March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
73
Advance
Informatio n
Notes:
1. SA = sector address (for Sector Erase), VA = Valid Address for reading status data (see “Write Operation Status”.)
2. Illustration shows device in word mode.
Figure 18. Chip/Sector Erase Operation Timings
Note: VA = Valid address. Illustration shows first status cycle after command sequence, last status read cycle, and array
data read cycle.
Figure 19. Data# Polling Timings (During Embedded Algorithms)
OE#
CE#
Addresses
VCC
WE#
Data
2AAh
SA
tAH
tWP
tWC
tAS
tWPH
555h for chip erase
10 for Chip Erase
30h
tDS
tVCS
tCS
tDH
55h
tCH
Status
DOUT
tWHWH2
VA
Erase Command Sequence (last two cycles)
Read Status Data
RY/BY#
tRB
tBUSY
WE#
CE#
OE#
High Z
tOE
High Z
DQ7
DQ0–DQ6
RY/BY#
tBUSY
Complement
True
Addresses
VA
tCH
VA
Status Data
Complement
Status Data
True
Valid Data
tPOLL
tACC
tCE
tOEH
tDF
tOH
tRC
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| S71GL064A04BFI0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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| S71GL064A04BFI0F2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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| S71GL064A04BFW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71GL064A04BFI0B3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFW0B0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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