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參數(shù)資料
| 型號(hào)： | S71GL064A04BFI0B2 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| 中文描述： | 堆疊式多芯片產(chǎn)品（MCP）的閃存和RAM |
| 文件頁(yè)數(shù)： | 80/102頁(yè) |
| 文件大?。?/td> | 1606K |
| 代理商： | S71GL064A04BFI0B2 |
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March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
79
Advance
Informatio n
Notes:
1. Figure indicates last two bus cycles of a program or erase operation.
2. PA = program address, SA = sector address, PD = program data.
3. DQ7# is the complement of the data written to the device. DOUT is the data written to the device.
4. Illustration shows device in word mode.
Figure 24. Alternate CE# Controlled Write (Erase/Program) Operation Timings
tGHEL
tWS
OE#
CE#
WE#
RESET#
tDS
Data
tAH
Addresses
tDH
tCP
DQ7#
DOUT
tWC
tAS
tCPH
PA
Data# Polling
PBD for program
55 for erase
tRH
tWHWH1 or 2
tPOLL
RY/BY#
tWH
29 for program buffer to flash
30 for sector erase
10 for chip erase
PBA for program
2AA for erase
SA for program buffer to flash
SA for sector erase
555 for chip erase
tBUSY
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| S71GL064A04BFI0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFW0B2 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFW0B3 | Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| S71GL064A04BFI0B3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F2 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFI0F3 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
| S71GL064A04BFW0B0 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM |
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