參數(shù)資料
型號(hào): S71GL064A04BFI0B3
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和RAM
文件頁(yè)數(shù): 88/102頁(yè)
文件大?。?/td> 1606K
代理商: S71GL064A04BFI0B3
86
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Notes:
1. High-Z and Low-Z parameters are characterized and are not 100% tested.
2. The internal write time of the memory is defined by the overlap of WE#, CE#1 = VIL, CE2 = VIH, BHE and/or BLE =VIL. All
signals must be Active to initiate a write and any of these signals can terminate a write by going Inactive. The data input set-
up and hold timing should be referenced to the edge of the signal that terminates write.
3. Data I/O is high impedance if OE#
VIH.
4. If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
5. During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Figure 28. Write Cycle 1 (WE# Controlled)
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S71GL064A04BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0F2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A04BFI0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFI0F3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A04BFW0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM