參數(shù)資料
型號(hào)： S71GL064A08BFI0B3
廠商： SPANSION LLC
元件分類： 存儲(chǔ)器
英文描述： Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述： SPECIALTY MEMORY CIRCUIT, PBGA56
封裝： 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件頁(yè)數(shù)： 77/134頁(yè)
文件大小： 2383K
代理商： S71GL064A08BFI0B3
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February 8, 2005 S71GL064A_00_A2
S71GL064A based MCPs
45
Advance
Informatio n
Figure 3. Write Buffer Programming Operation
Write “Write to Buffer”
command and
Sector Address
Write number of addresses
to program minus 1(WC)
and Sector Address
Write program buffer to
flash sector address
Write first address/data
Write to a different
sector address
FAIL or ABORT
PASS
Read DQ7 - DQ0 at
Last Loaded Address
Read DQ7 - DQ0 with
address = Last Loaded
Address
Write next address/data pair
WC = WC - 1
WC = 0 ?
Part of “Write to Buffer”
Command Sequence
Yes
No
Abort Write to
Buffer Operation?
DQ7 = Data?
DQ5 = 1?
DQ1 = 1?
Write to buffer ABORTED.
Must write “Write-to-buffer
Abort Reset” command
sequence to return
to read mode.
(Note 2)
(Note 3)
(Note 1)
Notes:
1.
When Sector Address is specified, any address in
the selected sector is acceptable. However, when
loading Write-Buffer address locations
with data, all addresses must fall within
the selected Write-Buffer Page.
2.
DQ7 may change simultaneously with
DQ5. Therefore, DQ7 should be verified.
3.
If this flowchart location was reached
because DQ5= “1”, then the device
FAILED. If this flowchart location was
reached because DQ1= “1”, then the
Write to Buffer operation was ABORTED.
In either case, the proper reset command
must be written before the device can
begin another operation. If DQ1=1, write
the Write-Buffer-Programming-Abort-
Reset command. if DQ5=1, write the
Reset command.
4.
See
Table 10 and for command
sequences required for write buffer
programming.
相關(guān)PDF資料
PDF描述
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08 STACKED MULTI CHIP PRODUCT FLASH MEMORY AND RAM
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
S71GL064A08BFI0F0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B0 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFW0B2 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
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