參數(shù)資料
型號: S71GL064A40BFI0B3
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和RAM
文件頁數(shù): 102/102頁
文件大?。?/td> 1606K
代理商: S71GL064A40BFI0B3
March 31, 2005 S71GL032A_00_A0
S71GL032A Based MCPs
99
Advance
Informatio n
Notes:
1. tHZ and tOHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to
output voltage levels.
2. At any given temperature and voltage condition, tHZ(Max.) is less than tLZ(Min.) both for a given device and from
device to device interconnection.
Figure 34. Timing Waveform of Read Cycle(2) (WE#=VIH, if BYTE# is Low, Ignore UB#/LB# Timing)
Figure 35. Timing Waveform of Write Cycle(1) (WE# controlled, if BYTE# is Low, Ignore UB#/LB# Timing)
High-Z
tRC
tOH
tAA
tCO1
tBA
tOE
tOLZ
tBLZ
tLZ
tOHZ
tBHZ
tHZ
tCO2
Address
CS1#
CS2
UB#, LB#
OE#
Data out
Data Valid
tWC
tCW(2)
tWR(4)
tAW
tBW
tWP(1)
tAS(3)
tDH
tDW
tWHZ
tOW
High-Z
tCW(2)
Address
CS1#
CS2
UB#, LB#
WE#
Data in
Data out
Data Undefined
Data Valid
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