參數(shù)資料
型號: S71GL064A40BFI0B3
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和RAM
文件頁數(shù): 73/102頁
文件大小: 1606K
代理商: S71GL064A40BFI0B3
72
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Notes:
1. PA = program address, PD = program data, DOUT is the true data at the program address.
2. Illustration shows device in word mode.
Figure 16. Program Operation Timings
Figure 17. Accelerated Program Timing Diagram
OE#
WE#
CE#
VCC
Data
Addresses
tDS
tAH
tDH
tWP
PD
tWHWH1
tWC
tAS
tWPH
tVCS
555h
PA
Read Status Data (last two cycles)
A0h
tPOLL
tCS
Status
DOUT
RY/BY#
tRB
tBUSY
tCH
PA
Program Command Sequence (last two cycles)
ACC
tVHH
VHH
VIL or VIH
tVHH
ACC
tVHH
VHH
VIL or VIH
tVHH
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