參數(shù)資料
型號: S71GL064A40BFI0B3
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: 堆疊式多芯片產(chǎn)品(MCP)的閃存和RAM
文件頁數(shù): 90/102頁
文件大小: 1606K
代理商: S71GL064A40BFI0B3
88
S71GL032A Based MCPs
S71GL032A_00_A0 March 31, 2005
Advance
Info rmation
Notes:
1. If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
2. During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Notes:
1. If Chip Enable goes Inactive simultaneously with WE# = High, the output remains in a high-impedance state.
2. During the Don’t Care period in the Data I/O waveform, the I/Os are in output state and input signals should not be applied.
Figure 30. Write Cycle 3 (WE# Controlled, OE# Low)
Figure 31. Write Cycle 4 (BHE#/BLE# Controlled, OE# Low)
VALID DATA
t
HD
t
SD
t
LZWE
t
PWE
t
SA
t
HA
t
AW
t
SCE
t
WC
t
HZWE
ADDRESS
CE2
DATA I/O
t
BW
DON’T CARE
CE#1
BHE#/BLE#
WE#
CE#1
CE2
BHE#/BLE#
WE#
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