參數(shù)資料
型號(hào)： SA58635UK
廠商： NXP SEMICONDUCTORS
元件分類： 音頻／視頻放大
英文描述： 2 x 25 mW class-G stereo headphone driver with I2C-bus volume control
中文描述： AUDIO AMPLIFIER, PBGA16
封裝： 1.70 X 1.70 MM, 0.56 MM HEIGHT, WLCSP-16
文件頁(yè)數(shù)： 18/30頁(yè)
文件大小： 277K
代理商： SA58635UK
SA58635_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
25 of 30
NXP Semiconductors
SA58635
2
× 25 mW class-G stereo headphone driver
15. Soldering of WLCSP packages
15.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
15.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
15.3 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 27) than a PbSn process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 15.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 27.
Table 15.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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參數(shù)描述
SA58635UK,027 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58637 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 2.2 W BTL audio amplifier
SA58637BS 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.2W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.2W, STER, D, 20HVQFN
SA58637BS,118 功能描述:音頻放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel
SA58637BS118 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20
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