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參數(shù)資料
| 型號： | SA58635UK |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2 x 25 mW class-G stereo headphone driver with I2C-bus volume control |
| 中文描述： | AUDIO AMPLIFIER, PBGA16 |
| 封裝： | 1.70 X 1.70 MM, 0.56 MM HEIGHT, WLCSP-16 |
| 文件頁數(shù)： | 19/30頁 |
| 文件大?。?/td> | 277K |
| 代理商： | SA58635UK |
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SA58635_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
26 of 30
NXP Semiconductors
SA58635
2
× 25 mW class-G stereo headphone driver
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
15.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
15.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
15.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 27. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
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| SA58670ABS | 2.1 W-channel stereo class-D audio amplifier |
| SA58670BS | 2.1 W-channel stereo class-D audio amplifier |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58635UK,027 | 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58637 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 2.2 W BTL audio amplifier |
| SA58637BS | 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.2W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.2W, STER, D, 20HVQFN |
| SA58637BS,118 | 功能描述:音頻放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58637BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
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