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參數(shù)資料
| 型號(hào)： | SA58635UK |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | 2 x 25 mW class-G stereo headphone driver with I2C-bus volume control |
| 中文描述： | AUDIO AMPLIFIER, PBGA16 |
| 封裝： | 1.70 X 1.70 MM, 0.56 MM HEIGHT, WLCSP-16 |
| 文件頁(yè)數(shù)： | 20/30頁(yè) |
| 文件大小： | 277K |
| 代理商： | SA58635UK |
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SA58635_1
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01 — 26 March 2010
27 of 30
NXP Semiconductors
SA58635
2
× 25 mW class-G stereo headphone driver
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
15.3.4 Cleaning
Cleaning can be done after reflow soldering.
16. Abbreviations
17. Revision history
Table 16.
Abbreviations
Acronym
Description
ASIP
Application Specific Instruction-set Processor
DVD
Digital Versatile Disk
ESD
ElectroStatic Discharge
ESR
Equivalent Series Resistance
FB
FeedBack
HP
HeadPhone
I2C-bus
Inter-integrated Circuit bus
PC
Personal Computer
PCB
Printed-Circuit Board
Table 17.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
SA58635_1
20100326
Product data sheet
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PDF描述 |
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| SA58637BS | 2 x 2.2 W BTL audio amplifier |
| SA58670ABS | 2.1 W-channel stereo class-D audio amplifier |
| SA58670BS | 2.1 W-channel stereo class-D audio amplifier |
| SA58672TK | 3.0 W mono class-D audio amplifier |
| SA58672UK | 3.0 W mono class-D audio amplifier |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SA58635UK,027 | 功能描述:音頻放大器 2x25mW cls-G stereo headphone driver RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58637 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:2 X 2.2 W BTL audio amplifier |
| SA58637BS | 制造商:NXP Semiconductors 功能描述:AMP AUDIO 2.2W STER D 20HVQFN 制造商:NXP Semiconductors 功能描述:AMP, AUDIO, 2.2W, STER, D, 20HVQFN |
| SA58637BS,118 | 功能描述:音頻放大器 DUAL 2.2W/CH. BTL RoHS:否 制造商:STMicroelectronics 產(chǎn)品:General Purpose Audio Amplifiers 輸出類型:Digital 輸出功率: THD + 噪聲: 工作電源電壓:3.3 V 電源電流: 最大功率耗散: 最大工作溫度: 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SA58637BS118 | 制造商:NXP Semiconductors 功能描述:IC AUDIO AMP AB 2.2W SON-20 |
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