
2004 Mar 04
55
Philips Semiconductors
Product specification
Digital video encoder
SAA7104E; SAA7105E
10 THERMAL CHARACTERISTICS
Note
1.
The overall R
th(j-a)
value can vary depending on the board layout. To minimize the effective R
th(j-a)
all power and
ground pins must be connected to the power and ground layers directly. An ample copper area direct under the
SAA7104E; SAA7105E with a number of through-hole plating, which connect to the ground layer (four-layer board:
second layer), can also reduce the effective R
th(j-a)
. Please do not use any solder-stop varnish under the chip. In
addition the usage of soldering glue with a high thermal conductance after curing is recommended.
11 CHARACTERISTICS
T
amb
= 0 to 70
°
C (typical values excluded); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
VALUE
38
(1)
UNIT
R
th(j-a)
thermal resistance from junction to ambient
in free air
K/W
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
V
DDA
V
DDD2
,
V
DDD3
,
V
DDD4
V
DDD1
analog supply voltage
digital supply voltage
3.15
3.15
3.3
3.3
3.45
3.45
V
V
digital supply voltage (DVO)
1.045
1.425
1.71
2.375
3.135
1
1
1.1
1.5
1.8
2.5
3.3
110
175
1.155
1.575
1.89
2.625
3.465
115
200
V
V
V
V
V
mA
mA
I
DDA
I
DDD
Inputs
analog supply current
digital supply current
note 1
note 2
V
IL
LOW-level input voltage
V
DDD1
= 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
V
DDD1
= 3.3 V; note 3
pins RESET, TMS, TCK,
TRST and TDI
V
DDD1
= 1.1 V, 1.5 V, 1.8 V
or 2.5 V; note 3
V
DDD1
= 3.3 V; note 3
pins RESET, TMS, TCK,
TRST and TDI
0.1
+0.2
V
0.5
0.5
+0.8
+0.8
V
V
V
IH
HIGH-level input voltage
V
DDD1
0.2
V
DDD1
+ 0.1 V
2
2
V
DDD1
+ 0.3 V
V
DDD2
+ 0.3 V
I
LI
C
i
input leakage current
input capacitance
10
10
10
10
μ
A
pF
pF
pF
clocks
data
I/Os at high-impedance