參數(shù)資料
型號(hào)： SC16C2552BIA44,518
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 26/37頁(yè)
文件大?。?/td> 0K
描述： IC UART DUAL SOT187-2
標(biāo)準(zhǔn)包裝： 500
特點(diǎn)： 2 通道
通道數(shù)： 2，DUART
FIFO's： 16 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶IrDA 編碼器/解碼器： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
帶調(diào)制解調(diào)器控制功能： 是
帶CMOS： 是
安裝類(lèi)型： 表面貼裝
封裝/外殼： 44-LCC（J 形引線(xiàn)）
供應(yīng)商設(shè)備封裝： 44-PLCC
包裝： 帶卷 (TR)
其它名稱(chēng)： 935274408518
SC16C2552BIA44-T
SC16C2552BIA44-T-ND
SC16C2552B_3
NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 03 — 12 February 2009
32 of 38
NXP Semiconductors
SC16C2552B
5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs
12. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note
AN10365 “Surface mount reow
soldering description”.
12.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for ne pitch SMDs. Reow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
12.2 Wave and reow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
Through-hole components
Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature prole. Leaded packages,
packages with solder balls, and leadless packages are all reow solderable.
Key characteristics in both wave and reow soldering are:
Board specications, including the board nish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
12.3 Wave soldering
Key characteristics in wave soldering are:
Process issues, such as application of adhesive and ux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
Solder bath specications, including temperature and impurities
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C2552BIA44-T 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C2552CIA44,512 制造商:NXP Semiconductors 功能描述: 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/TUBEDP// - Rail/Tube
SC16C2552CIA44,518 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/REEL13DP// - Tape and Reel
SC16C2552CIA44,529 制造商:NXP Semiconductors 功能描述:SC16C2552CIA44/PLCC44/TUBESMDP// - Rail/Tube
SC16C2552IA44 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:Dual UART with 16-byte transmit and receive FIFOs
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