參數(shù)資料
型號(hào)： SC16C752BIBS,157
廠商： NXP Semiconductors
文件頁(yè)數(shù)： 38/47頁(yè)
文件大?。?/td> 0K
描述： IC DUAL UART 64BYTE 32HVQFN
標(biāo)準(zhǔn)包裝： 2,450
通道數(shù)： 2，DUART
FIFO's： 64 字節(jié)
電源電壓： 2.5V，3.3V，5V
帶自動(dòng)流量控制功能： 是
帶故障啟動(dòng)位檢測(cè)功能： 是
帶調(diào)制解調(diào)器控制功能： 是
安裝類型： 表面貼裝
封裝/外殼： 32-VFQFN 裸露焊盤
供應(yīng)商設(shè)備封裝： 32-HVQFN（5x5）
包裝： 托盤
其它名稱： 935276389157
SC16C752BIBS
SC16C752BIBS-ND
SC16C752B
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 6 — 30 November 2010
43 of 47
NXP Semiconductors
SC16C752B
5 V, 2.2 V and 2.5 V dual UART, 5 Mbit/s (max.), with 64-byte FIFOs
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 25) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 27 and 28
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 25.
Table 27.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 28.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C752BIBS-F 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752BIBS-S 功能描述:UART 接口集成電路 2CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752IB48 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Dual UART with 64-byte FIFO
SC16C752IB48,128 功能描述:UART 接口集成電路 Dual UART 64-byte FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C752IB48,151 功能描述:UART 接口集成電路 16C 2.5V-5V 2CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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