參數資料
| 型號： | SC16C752IB48,128 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 38/47頁 |
| 文件大小： | 0K |
| 描述： | IC DUAL UART 64BYTE 48LQFP |
| 標準包裝： | 1 |
| 通道數： | 2，DUART |
| FIFO's： | 64 字節(jié) |
| 電源電壓： | 2.5V，3.3V，5V |
| 帶自動流量控制功能： | 是 |
| 帶故障啟動位檢測功能： | 是 |
| 帶調制解調器控制功能： | 是 |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 48-LQFP |
| 供應商設備封裝： | 48-LQFP（7x7） |
| 包裝： | 標準包裝 |
| 其它名稱： | 568-5955-6 |
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Philips Semiconductors
SC16C752
Dual UART with 64-byte FIFO
Product data
Rev. 04 — 20 June 2003
43 of 47
9397 750 11635
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our
Data Handbook IC26; Integrated Circuit
Packages (document order number 9398 652 90011).
There is no soldering method that is ideal for all IC packages. Wave soldering can still
be used for certain surface mount ICs, but it is not suitable for ne pitch SMDs. In
these situations reow soldering is recommended. In these situations reow
soldering is recommended.
13.2 Reow soldering
Reow soldering requires solder paste (a suspension of ne solder particles, ux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reow peak temperatures range from 215 to 270
°C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 220
°C (SnPb process) or below 245 °C (Pb-free process)
– for all BGA and SSOP-T packages
– for packages with a thickness
≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a volume
≥ 350 mm3 so called
thick/large packages.
below 235
°C (SnPb process) or below 260 °C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| SC16C754 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Quad UART with 64-byte FIFO |
| SC16C754B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 64-byte FIFOs |
| SC16C754BIA68 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C754BIA68,512 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C754BIA68,518 | 功能描述:UART 接口集成電路 4CH. UART 64B FIFO RoHS:否 制造商:Texas Instruments 通道數量:2 數據速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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