參數(shù)資料
型號(hào): SDM-USB-QS-S_
廠商: Linx Technologies Inc
文件頁數(shù): 8/24頁
文件大?。?/td> 0K
描述: MODULE USB LOW SPEED
產(chǎn)品目錄繪圖: SDM-USB-QS-S Top
SDM-USB-QS-S Side
標(biāo)準(zhǔn)包裝: 25
系列: QS
應(yīng)用: USB,外設(shè)
接口: 并行/串行
電源電壓: 4.35 V ~ 5.25 V
封裝/外殼: 16-SMD 模塊
供應(yīng)商設(shè)備封裝: 模塊
包裝: 管件
安裝類型: 表面貼裝
其它名稱: SDM-USB-QS-S
SDM-USB-QS-S_-ND
SDM-USB-QS1-S
12
Changing the Device Descriptions
The QS can be customized to display your product’s name, manufacturer
name, and to use different Product Identifiers (PID) and Vendor Identifiers
(VID). This allows an end user to see the final product’s name in their
Windows Device Manager and when the hardware is first loaded. The
PID and VID are set by the USB Implementers Forum and should not be
changed unless the final product has gone through the certification process
and received its own unique IDs.
The Manufacturer, Description, and Serial Number strings can all be
modified using the QS EEPROM Programmer software, which can
be downloaded from the Linx web site. This easy-to-use software will
reprogram the module via the USB bus and can be done as a part of the
final testing procedure.
Once the module is reprogrammed, some modifications to the driver files
may be necessary. If a VID and PID other than the default Linx numbers
are used, these numbers will need to be added to the files. This requires
modifying several lines in the .inf files and is described in detail in the QS
Series Programmer’s Guide. Modifying the name displayed by the Windows
Device Manager requires changing only one line, also described in the
Programmer’s Guide.
相關(guān)PDF資料
PDF描述
SI2457-D-GT IC ISOMODEM GLOBAL DAA 24TSSOP
SI3016-BS IC LINE-SIDE DAA 16SOIC
SI3452D-B01-GM IC POE CONTROLLER MIDSPAN 40QFN
SI4126-F-BMR IC SYNTHESIZER RF2/IF 28MLP
SI5040-A-GM IC TXRX XFP 10GBPS 32LGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SDM-USB-QS-S_ 功能描述:MODULE USB LOW SPEED RoHS:是 類別:集成電路 (IC) >> 接口 - 專用 系列:QS 特色產(chǎn)品:NXP - I2C Interface 標(biāo)準(zhǔn)包裝:1 系列:- 應(yīng)用:2 通道 I²C 多路復(fù)用器 接口:I²C,SM 總線 電源電壓:2.3 V ~ 5.5 V 封裝/外殼:16-TSSOP(0.173",4.40mm 寬) 供應(yīng)商設(shè)備封裝:16-TSSOP 包裝:剪切帶 (CT) 安裝類型:表面貼裝 產(chǎn)品目錄頁面:825 (CN2011-ZH PDF) 其它名稱:568-1854-1
SDMX-10TR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch
SDMX-10-X 功能描述:DIP 開關(guān)/ SIP 開關(guān) 10Pos SMT DIP RoHS:否 制造商:Omron Electronics 位置數(shù)量:10 開關(guān)類型:DIP 執(zhí)行器:Rotary 端子節(jié)距:2.54 mm 觸點(diǎn)形式: 端接類型:Solder Pin 電流額定值:100 mA 電壓額定值 DC: 工作溫度范圍: 安裝:Through Hole
SDMX-10XR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch
SDMX-12TR 制造商:BOURNS 制造商全稱:Bourns Electronic Solutions 功能描述:Surface Mount DIP Switch