參數(shù)資料
型號: SI5319-EVB
廠商: Silicon Laboratories Inc
文件頁數(shù): 41/50頁
文件大?。?/td> 0K
描述: BOARD EVALUATION SI5319
標(biāo)準(zhǔn)包裝: 1
主要目的: 計(jì)時(shí),時(shí)鐘乘法器
嵌入式:
已用 IC / 零件: SI5319
主要屬性: 1 輸入,1 輸出
次要屬性: CML,CMOS,LVDS,LVPECL
已供物品: 板,CD,文檔
Si5319
46
Rev. 1.0
Table 11. PCB Land Pattern Dimensions
Dimension
MIN
MAX
e
0.50 BSC.
E5.42 REF.
D5.42 REF.
E2
4.00
4.20
D2
4.00
4.20
GE
4.53
GD
4.53
X
0.28
Y0.89 REF.
ZE
6.31
ZD
6.31
Notes (General):
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2.
Dimensioning and Tolerancing is per the ANSI Y14.5M-1994 specification.
3.
This Land Pattern Design is based on IPC-SM-782 guidelines.
4.
All dimensions shown are at Maximum Material Condition (MMC). Least Material
Condition (LMC) is calculated based on a Fabrication Allowance of 0.05 mm.
Notes (Solder Mask Design):
1.
All metal pads are to be non-solder mask defined (NSMD). Clearance between the
solder mask and the metal pad is to be 60 m minimum, all the way around the pad.
Notes (Stencil Design):
1.
A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be
used to assure good solder paste release.
2.
The stencil thickness should be 0.125 mm (5 mils).
3.
The ratio of stencil aperture to land pad size should be 1:1 for the perimeter pads.
4.
A 4 x 4 array of 0.80 mm square openings on 1.05 mm pitch should be used for the
center ground pad.
Notes (Card Assembly):
1.
A No-Clean, Type-3 solder paste is recommended.
2.
The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for
Small Body Components.
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