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參數資料
| 型號： | SL2ICS5101EW/V7,00 |
| 廠商： | NXP Semiconductors |
| 文件頁數： | 19/28頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC I-CODE SLI SMART LABEL DIE |
| 標準包裝： | 28,477 |
| 系列： | * |
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NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 3.0 — 14 March 2007
26 of 28
NXP Semiconductors
SL2 ICS50/SL2 ICS51
ICODE SLI-L/ICODE SLI-L HC
PUBLIC
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
10.2 Definitions
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
<Name> — is a trademark of NXP B.V. (replace by text inset t001tma<1nn>)
11. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
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相關代理商/技術參數 |
參數描述 |
|---|---|
| SL2ICS5301EW/V7,00 | 功能描述:數據轉換系統(tǒng) Wafer addendum RoHS:否 制造商:Texas Instruments 轉換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SL2ICS5301EW/V7L,005 | 制造商:NXP Semiconductors 功能描述: |
| SL2ICS5311EW/V7,00 | 功能描述:數據轉換系統(tǒng) Bumped Wafer RoHS:否 制造商:Texas Instruments 轉換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
| SL2ICS5311EW/V7,005 | 制造商:NXP Semiconductors 功能描述: |
| SL2ICS5401EW/V7,00 | 功能描述:數據轉換系統(tǒng) sawn wafer 150um on film frame carrie RoHS:否 制造商:Texas Instruments 轉換速率:0.001 MSPs 分辨率:24 bit 最大工作溫度:+ 125 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TQFP-64 封裝:Reel |
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