2
Rev: B Date:7/7/04
-
SP526 Multi–Mode Serial Transceiver
Copyright 2004 Sipex Corporation
T
A
= +25
°
C and V
CC
= +4.75V to +5.25V unless otherwise noted.
PARAMETER
LOGIC INPUTS
V
IL
V
IH
LOGIC OUTPUTS
V
OL
V
OH
V.28 DRIVER
DC Parameters
Outputs
Open Circuit Voltage
Loaded Voltage
Short-Circuit Current
Power-Off Impedance
AC Parameters
Outputs
Transition Time
Instantaneous Slew Rate
Propagation Delay
t
PHL
t
Max.Transmission Rate
MIN.
TYP.
MAX.
UNITS
CONDITIONS
0.8
Volts
Volts
2.0
0.4
Volts
Volts
I
OUT
= – 3.2mA
I
OUT
= 1.0mA
2.4
±
15
±
15
±
100
Volts
Volts
mA
per Figure 1
per Figure 2
per Figure 4
per Figure 5
V
CC
= +5V for AC parameters
±
5.0
300
1.5
30
μ
s
V/
μ
s
per Figure 6; +3V to -3V
per Figure 3
0.5
0.5
120
1
1
5
5
μ
s
μ
s
kbps
230
V.28 RECEIVER
DC Parameters
Inputs
Input Impedance
Open-Circuit Bias
HIGH Threshold
LOW Threshold
AC Parameters
Propagation Delay
t
PHL
t
PLH
3
7
k
Volts
Volts
Volts
per Figure 7
per Figure 8
+2.0
3.0
1.7
1.2
0.8
V
CC
= +5V for AC parameters
50
50
100
100
500
500
ns
ns
ABSOLUTE MAXIMUM RATINGS
These are stress ratings only and functional operation
of the device at these ratings or any other above those
indicated in the operation sections of the specifications
below is not implied. Exposure to absolute maximum
rating conditions for extended periods of time may
affect reliability.
V
............................................................................+7V
Input Voltages:
Logic...............................-0.3V to (V
CC
+0.5V)
Drivers............................-0.3V to (V
CC
+0.5V)
Receivers........................................
±
15.5V
Output Voltages:
Logic................................-0.3V to (V
+0.5V)
Drivers................................................
±
15V
Receivers........................-0.3V to (V
+0.5V)
Storage Temperature..........................-65
C to +150
C
Power Dissipation
(derate 14.3mW/
C above 70
C)................1144mW
STORAGE CONSIDERATIONS
Due to the relatively large package size of the 44-pin
quad flat-pack, storage in a low humidity environment
is preferred. Large high density plastic packages are
moisture sensitive and should be stored in Dry Vapor
Barrier Bags. Prior to usage, the parts should remain
bagged and stored below 40
°
C and 60%RH. If the
parts are removed from the bag, they should be used
within 48 hours or stored in an environment at or below
20%RH. If the above conditions cannot be followed,
the parts should be baked for four hours at 125
°
C
in order remove moisture prior to soldering. Sipex ships
the 44-pin QFP in Dry Vapor Barrier Bags with
a humidity indicator card and desiccant pack. The
humidity indicator should be below 30%RH.
ELECTRICAL CHARACTERISTICS